The 5th edition of the 3D Printing Electronics Conference took place on January 23, 2018, at High Tech Campus Eindhoven, The Netherlands.
The conference attracted over 70 international delegates and provided great intellectual and social interaction to all participants.
The program featured 10 internationally renowned speakers from SABIC, Buzz Technology, PwC, TNO, CEA-LETI, Fundacio Eurecat, Neotech, adphos, University of Hamburg and Jiangnan University, who shared their knowledge and expertise on a variety of topics related to 3D Printing Electronics.
The discussions focused on topics such as the “Uberisation Era” of Consumer Electronic Product Manufacturing, Packaging of electronic devices using 3D printing, Dimensional Control and Process Assembly for 3D Electronics at Industrial Scale, In-mould Electronics: from rigid PCB to 3D and flexible, Hybrid printed electronics on 3D objects and many more.
Presentations from 2017 edition are open to public and can be downloaded from here.
Below you can find the program of the 3D Printing Electronics Conference 2018, which took place on Jan 23, 2018, at High Tech Campus Eindhoven, The Netherlands.
|9:00||9:30||Welcome and registration|
|9:30||9:35||Moderator: Pieter Hermans, Matchmaker for Innovators, Jakajima|
|9:35||10:05||Corne Rentrop, Project Coordinator, Holst Centre/ TNO, The Netherlands, on “Printed Electronics: towards Industrial application”, More information|
|10:05||10:35||Mohammad Mashayekhi, Senior Scientist, Fundació Eurecat, Spain, on “Hybrid printed electronics on 3D objects”, More information|
|10:35||11:00||Coffee Break and visit expo|
|11:00||11:30||Johannes Hoerber, Product Development Manager, Neotech AMT GmbH, Germany, on “Fully Additive – The Convergence of 3D Printing and 3D Printed Electronics”, More information|
|11:30||12:00||Janaina Gianfelice de Castro, Business Development Analyst, SABIC, on ‘In-mould Electronics: from rigid PCB to 3D and flexible’, More information|
|12:00||12:30||Yu Liu, Professor, Institute of Precision Intelligent System Engineering (iPISE), School of Mechanical Engineering, Jiangnan University, China, on “Dimensional Control and Process Assembly for 3D Electronics at Industrial Scale”, More information|
|12:30||13:30||Lunch break and visit expo|
|13:30||14:00||Wolter Kersbergen, Manager Innovation & Development, PwC Nederland, The Netherlands on “3D Printing is more than technology”, More information|
|14:00||14:30||Gabrielle Aspar, PhD Student, LETI, CEA Grenoble, France, on “Packaging of electronic devices using 3D printing technology”, More information|
|14:30||15:00||Dr. Kai K. O. Bär, Managing Director/President, adphos Innovative Technologies, Germany, More information|
|15:00||15:45||Break and visit expo|
|15:45||16:15||Senake Atureliya, CEO, Buzz Technology Limited, on “Creating the Uber of Consumer Electronic Product Manufacturing”, More information; Read the interview
|16:15||16:45||Florens Wasserfall, Research Associate (PhD Student), University of Hamburg, Germany, on “Design Toolchain and Slicing Process for the Integration of Electronics into FDM Printed Objects”, More information|
|16:45||18:00||Drinks and visit expo|