A lot of potential for 3D printed electronics in the automotive field

3D printing is affecting the way engineers design in the automotive
industry. The technology is already used in the industry, currently
mostly for plastic and metal spare parts. Additive manufacturing has
opened the door for newer designs, safer products, shorter lead times
and lower costs. Moreover, it will be an enabler for the automotive industry to adapt towards the new smart mobility requirements.

Continue reading “A lot of potential for 3D printed electronics in the automotive field”

Printed Electronics in Education – Presented by Jan Bernards, Fontys University

Jan Berbards

Printed Electronics in Education – Presented by Jan Bernards, Fontys University, at 3D Printing Electronics Conference, on Jan 22, 2019, at High Tech Campus Eindhoven, The Netherlands.

One of the focal points of the research group Applied Natural Sciences (ANS) at the Fontys University of Applied Sciences is Thin Films & Functional Materials. In our laboratory equipment is available for the deposition (inkjet printing, screen printing, plasma printing, spin coating, slot die coating, vacuum deposition) and analysis (SEM with EDS, contact angle measurement, rheology, dynamic light scattering for particle measurement, profilometer) of thin films. Continue reading “Printed Electronics in Education – Presented by Jan Bernards, Fontys University”

3D Printing Electronics Conference welcomes CECIMO as Content Partner

cecimo

3D Printing Electronics Conference welcomes CECIMO as Content Partner

About Cecimo
Cecimo is the European Association representing the common interests of the Machine Tool Industries globally and at EU level. We bring together 15 National Associations of machine tool builders, which represent approximately 1300 industrial enterprises in Europe (EU + EFTA + Turkey), over 80% of which are SMEs. Continue reading “3D Printing Electronics Conference welcomes CECIMO as Content Partner”

3D Printing Electronics Conference welcomes Holst Centre as Exhibitor

holst centre

3D Printing Electronics Conference welcomes Holst Centre as Exhibitor

About  Holst Centre
Holst Centre bridges the gap between industry and academia, advancing flexible electronics from lab to fab through robust roadmaps and programs. Working with industrial partners, Holst Centre co-creates innovative solutions for healthcare, automotive, and IOT. Holst Centre is an independent shared-innovation R&D Centre, founded by TNO and IMEC in 2005. Continue reading “3D Printing Electronics Conference welcomes Holst Centre as Exhibitor”

3D Printing Electronics Conference welcomes LifeSense Group as exhibitor

LifeSense Group

3D Printing Electronics Conference welcomes LifeSense Group as exhibitor

About  LifeSense Group
LifeSense Group is a B2b Netherlands based wearable technology company with customers worldwide. LSG aims to empower people everyday by revolutionizing healthcare with wearable technology. Our international team draws on their breadth of knowledge, expertise, and experiences to continually bring forth new designs and applications for wearable technology. Continue reading “3D Printing Electronics Conference welcomes LifeSense Group as exhibitor”

Hybrid electronics integration by inkjet technology – Presented by Marcel Grooten, DoMicro BV

Marcel Grooten

Hybrid electronics integration by inkjet technology – Presented by Marcel Grooten, DoMicro BV, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

DoMicro BV has progressed in advanced packaging and integration of conventional electronics in flexible foils structures. Printing multi-layers, passive components and interconnection of thinned silicon dies is enabled by revolutionary developments in nano-printing and specific inkjet technology. Several examples will be discussed including a functional flexible microsensor application. Continue reading “Hybrid electronics integration by inkjet technology – Presented by Marcel Grooten, DoMicro BV”

3D Printing Electronics Conference welcomes Metafas as exhibitor

metafas

3D Printing Electronics Conference welcomes Metafas as exhibitor

About  Metafas
Metafas develops and produces front and control panels (user interfacing) and printed electronics in Asten, Noord-Brabant nearby Eindhoven. Therefore we combine innovative production methods with specialist techniques and professional knowledge. In our facility we have a DTP department and use computer to screen (CTS) for preparation of the screens. Continue reading “3D Printing Electronics Conference welcomes Metafas as exhibitor”

Printed electronics – overview of the fundamentals, applications and equipment – Presented by Corne Rentrop, TNO – Holst Centre

Corne Rentrop

Printed electronics – overview of the fundamentals, applications and equipment – Presented by Corne Rentrop, TNO – Holst Centre, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

Holst Centre has been active in printed electronics for 12 years. In these 12 years the development of printed electronics was matured from basic fundamental research (TRL 3-4) towards application research (TRL6-7). In the latest developments the (R2R) printing and assembly equipment was matured as well as development of new interconnection technologies. The talk will explain these technologies in more detail and wll show the latest (large scale) applications. Continue reading “Printed electronics – overview of the fundamentals, applications and equipment – Presented by Corne Rentrop, TNO – Holst Centre”

3D Printing Electronics Conference welcomes Fontys University of Applied Sciences as exhibitor

fontys

3D Printing Electronics Conference welcomes Fontys University of Applied Sciences as exhibitor

About  Fontys University of Applied Sciences
One of the spearheads of the research group Applied Natural Sciences at the Fontys University of Applied Sciences is Thin Films & Functional Materials. With a combination of 2D and 3D printing techniques biomedical sensors and applications of printed electronics are investigated in cooperation with companies and other research institutes. Continue reading “3D Printing Electronics Conference welcomes Fontys University of Applied Sciences as exhibitor”

Francis Van Vehmendahl, Mitsubishi Engineering Plastics will speak at 3D Printing Electronics Conference 2019

Francis Van Vehmendahl

Francis Van Vehmendahl, Mitsubishi Engineering Plastics will speak at 3D Printing Electronics Conference 2019

In the last decade the LPKF-LDS technology matured into an accepted manufacturing method. This is especially the case in Asia were LDS materials are widely applied in wireless communication devices, such as mobile phones, notebooks and smart wearables. The most common used LDS material for these antenna applications is polycarbonate (PC) due to its well-balanced properties such as impact strength, processability, surface appearance and radio frequency (RF) performance. Continue reading “Francis Van Vehmendahl, Mitsubishi Engineering Plastics will speak at 3D Printing Electronics Conference 2019”