Francis Van Vehmendahl, Mitsubishi Engineering Plastics will speak at 3D Printing Electronics Conference 2019

Francis Van Vehmendahl

Francis Van Vehmendahl, Mitsubishi Engineering Plastics will speak at 3D Printing Electronics Conference 2019

In the last decade the LPKF-LDS technology matured into an accepted manufacturing method. This is especially the case in Asia were LDS materials are widely applied in wireless communication devices, such as mobile phones, notebooks and smart wearables. The most common used LDS material for these antenna applications is polycarbonate (PC) due to its well-balanced properties such as impact strength, processability, surface appearance and radio frequency (RF) performance. Continue reading “Francis Van Vehmendahl, Mitsubishi Engineering Plastics will speak at 3D Printing Electronics Conference 2019”

3D Printing Electronics Conference welcomes DoMicro BV as exhibitor

domicro

3D Printing Electronics Conference welcomes DoMicro BV as exhibitor

About DoMicro BV
Flexible hybrid electronics. DoMicro BV is a high tech company creating value by additive technologies in electronic manufacturing. DoMicro focuses on technology development for flexible hybrid and printed electronics providing innovative manufacturing technology and application solutions. By inkjet printing technology, new capabilities arise in flexible hybrid electronics. Visit our website: www.domicro.nl. Continue reading “3D Printing Electronics Conference welcomes DoMicro BV as exhibitor”

Printed Stretchable Circuits: A breakthrough – Presented by Mahmoud Tavakoli, Institute of Systems and Robotics

Mahmoud Tavakoli

Printed Stretchable Circuits: A breakthrough – Presented by Mahmoud Tavakoli, Institute of Systems and Robotics, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

In this talk I will cover a series of novel methods and materials for printing stretchable circuits. We created the first ever method for inkjet printing of highly stretchable circuits, and then we adapted this method for laser printing or screen printing methods. Circuits are instantly sintered at room temperature, without requiring temperature or light pulses, and at the same time the circuits become highly stretchable. I will show applications of this method for rapid prototyping of ultrathin e-skin, as an electronic tattoo for biomonitoring or circuits that are transferred over 3D objects to enable tactile input, proximity detection, pressure detection or other applications. Finally i will present a stretchable conductive ink and adhesive which allows direct writing of stretchable circuits. Continue reading “Printed Stretchable Circuits: A breakthrough – Presented by Mahmoud Tavakoli, Institute of Systems and Robotics”

3D Printed Electronics – Agile Manufacture of Mechatronic Systems – Presented by Martin Hedges, Neotech AMT

Martin Hedges

3D Printed Electronics – Agile Manufacture of Mechatronic Systems – Presented by Martin Hedges, Neotech AMT, at 3D Printing Electronics Conference, which will take place on January 22, 2019, at High Tech Campus Eindhoven.

This presentation will review the state-of-the-art related to the production of 3D mechatronic systems via Additive Manufacturing (AM) processes and the scalability to high volume manufacture.

A reconfigurable array of structural and electronics printing, pre- and post processing techniques are combined with SMD technologies to enable digitally driven 3D electronics manufacturing. The resultant flexible process chains can be easily reconfigured to cope with rapid changes in product type whilst retaining the ability to be scaled through to high volume manufacture. Selection of the most appropriate print, pre- and post-processing methods with the subsequent effect on process speed and cost will be discussed. A review of current applications, spanning 3D electronic circuits, antenna, sensor and heater patterns will be conducted along with an update on the progression to First Time Right manufacture of complex devices.

About Dr. Martin Hedges
Graduated BSc (Materials Science) from the University of Manchester (UK) in 1987. Completed a PhD in Materials Science in 1990 from UMIST (UK).
Founded the company Neotech in Nuremberg in 2001 to develop additive manufacturing processes with a focus on Printed Electronics
Since 2009 the company has been pioneering the development of 3D Printed Electronics. Continue reading “3D Printed Electronics – Agile Manufacture of Mechatronic Systems – Presented by Martin Hedges, Neotech AMT”

Technologische Ontwikkeling Is Media Partner of 3D Printing Electronics Conference

Technologische Ontwikkeling

Technologische Ontwikkeling Is Media Partner of 3D Printing Electronics Conference, which will take place on January 22, 2019, at High Tech Campus Eindhoven, The Netherlands.

About Technologische Ontwikkeling
Technologische Ontwikkeling is the corresponding website for all technologically related publications of MediaPlanet.

Mediaplanet creates useful content that educates our audience and positions our clients as solution providers Continue reading “Technologische Ontwikkeling Is Media Partner of 3D Printing Electronics Conference”

Printing of metal structures on 3D-printed polymer parts – Presented by Volker Zöllmer, Fraunhofer IFAM

Volker Zöllmer

Printing of metal structures on 3D-printed polymer parts – Presented by Volker Zöllmer, Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

Interview
What drives you?
New technologies, printed electronics, 3D-printing, digital transformation

What are the three things you would take with you on a deserted island?
3D-printer, Smartphone, picture of my family Continue reading “Printing of metal structures on 3D-printed polymer parts – Presented by Volker Zöllmer, Fraunhofer IFAM”

Integrated Electronic Functionalities in 3D Printed Products – Presented by Fabien Bruning, TNO

Fabien Bruning

Integrated Electronic Functionalities in 3D Printed Products – Presented by Fabien Bruning, TNO, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

Combining the flexibility of 3D printing techniques with technologies from flexible electronics creates a new manufacturing paradigm for products with integrated electronic functionalities. Free form is no longer only applicable to the structural part, but also to the embedded electronics. In this presentation we will showcase our development based on SLA (Stereo Lithography). With SLA high quality 3D products can be manufactured, yet the integration with other manufacturing technologies is more challenging than some other AM technologies. This presentation will focus on the challenges and our achievements in integrating electronic structures during the 3D printing processes.

Continue reading “Integrated Electronic Functionalities in 3D Printed Products – Presented by Fabien Bruning, TNO”

Manufacturing Technology Insights is media partner of 3D Printing Electronics Conference

Manufacturing Technology

Manufacturing Technology Insights is media partner of 3D Printing Electronics Conference

About Manufacturing Technology Insights
With immense industrial experience, Manufacturing Technology Insights is helping the industrial manufacturers focus their investments towards developing technology platforms and new operating models that can take their organisation to new heights and integrate their customers’ operations.

Manufacturing Technology Insights is increasing the organizational visibility and advising firms on the connectivity tools that can provide an insight into production levels, inventory and capacity availability, quality levels, and order status from all their suppliers. Following a unique model of learn-from-peer approach, Manufacturing Technology Insights is always looking for industry leaders to share their experiences, wisdom, and advice with our readership. Continue reading “Manufacturing Technology Insights is media partner of 3D Printing Electronics Conference”