Printed Electronics in Education – Presented by Jan Bernards, Fontys University

Jan Berbards

Printed Electronics in Education – Presented by Jan Bernards, Fontys University, at 3D Printing Electronics Conference, on Jan 22, 2019, at High Tech Campus Eindhoven, The Netherlands.

One of the focal points of the research group Applied Natural Sciences (ANS) at the Fontys University of Applied Sciences is Thin Films & Functional Materials. In our laboratory equipment is available for the deposition (inkjet printing, screen printing, plasma printing, spin coating, slot die coating, vacuum deposition) and analysis (SEM with EDS, contact angle measurement, rheology, dynamic light scattering for particle measurement, profilometer) of thin films. Continue reading “Printed Electronics in Education – Presented by Jan Bernards, Fontys University”

Hybrid electronics integration by inkjet technology – Presented by Marcel Grooten, DoMicro BV

Marcel Grooten

Hybrid electronics integration by inkjet technology – Presented by Marcel Grooten, DoMicro BV, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

DoMicro BV has progressed in advanced packaging and integration of conventional electronics in flexible foils structures. Printing multi-layers, passive components and interconnection of thinned silicon dies is enabled by revolutionary developments in nano-printing and specific inkjet technology. Several examples will be discussed including a functional flexible microsensor application. Continue reading “Hybrid electronics integration by inkjet technology – Presented by Marcel Grooten, DoMicro BV”

Printed electronics – overview of the fundamentals, applications and equipment – Presented by Corne Rentrop, TNO – Holst Centre

Corne Rentrop

Printed electronics – overview of the fundamentals, applications and equipment – Presented by Corne Rentrop, TNO – Holst Centre, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

Holst Centre has been active in printed electronics for 12 years. In these 12 years the development of printed electronics was matured from basic fundamental research (TRL 3-4) towards application research (TRL6-7). In the latest developments the (R2R) printing and assembly equipment was matured as well as development of new interconnection technologies. The talk will explain these technologies in more detail and wll show the latest (large scale) applications. Continue reading “Printed electronics – overview of the fundamentals, applications and equipment – Presented by Corne Rentrop, TNO – Holst Centre”

Francis Van Vehmendahl, Mitsubishi Engineering Plastics will speak at 3D Printing Electronics Conference 2019

Francis Van Vehmendahl

Francis Van Vehmendahl, Mitsubishi Engineering Plastics will speak at 3D Printing Electronics Conference 2019

In the last decade the LPKF-LDS technology matured into an accepted manufacturing method. This is especially the case in Asia were LDS materials are widely applied in wireless communication devices, such as mobile phones, notebooks and smart wearables. The most common used LDS material for these antenna applications is polycarbonate (PC) due to its well-balanced properties such as impact strength, processability, surface appearance and radio frequency (RF) performance. Continue reading “Francis Van Vehmendahl, Mitsubishi Engineering Plastics will speak at 3D Printing Electronics Conference 2019”

Printed Stretchable Circuits: A breakthrough – Presented by Mahmoud Tavakoli, Institute of Systems and Robotics

Mahmoud Tavakoli

Printed Stretchable Circuits: A breakthrough – Presented by Mahmoud Tavakoli, Institute of Systems and Robotics, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

In this talk I will cover a series of novel methods and materials for printing stretchable circuits. We created the first ever method for inkjet printing of highly stretchable circuits, and then we adapted this method for laser printing or screen printing methods. Circuits are instantly sintered at room temperature, without requiring temperature or light pulses, and at the same time the circuits become highly stretchable. I will show applications of this method for rapid prototyping of ultrathin e-skin, as an electronic tattoo for biomonitoring or circuits that are transferred over 3D objects to enable tactile input, proximity detection, pressure detection or other applications. Finally i will present a stretchable conductive ink and adhesive which allows direct writing of stretchable circuits. Continue reading “Printed Stretchable Circuits: A breakthrough – Presented by Mahmoud Tavakoli, Institute of Systems and Robotics”

3D Printed Electronics – Agile Manufacture of Mechatronic Systems – Presented by Martin Hedges, Neotech AMT

Martin Hedges

3D Printed Electronics – Agile Manufacture of Mechatronic Systems – Presented by Martin Hedges, Neotech AMT, at 3D Printing Electronics Conference, which will take place on January 22, 2019, at High Tech Campus Eindhoven.

This presentation will review the state-of-the-art related to the production of 3D mechatronic systems via Additive Manufacturing (AM) processes and the scalability to high volume manufacture.

A reconfigurable array of structural and electronics printing, pre- and post processing techniques are combined with SMD technologies to enable digitally driven 3D electronics manufacturing. The resultant flexible process chains can be easily reconfigured to cope with rapid changes in product type whilst retaining the ability to be scaled through to high volume manufacture. Selection of the most appropriate print, pre- and post-processing methods with the subsequent effect on process speed and cost will be discussed. A review of current applications, spanning 3D electronic circuits, antenna, sensor and heater patterns will be conducted along with an update on the progression to First Time Right manufacture of complex devices.

About Dr. Martin Hedges
Graduated BSc (Materials Science) from the University of Manchester (UK) in 1987. Completed a PhD in Materials Science in 1990 from UMIST (UK).
Founded the company Neotech in Nuremberg in 2001 to develop additive manufacturing processes with a focus on Printed Electronics
Since 2009 the company has been pioneering the development of 3D Printed Electronics. Continue reading “3D Printed Electronics – Agile Manufacture of Mechatronic Systems – Presented by Martin Hedges, Neotech AMT”

Printed electronics in practice for a SME – Presented by Hans van de Mortel, Metafas

Hans van de Mortel

Printed electronics in practice for a SME – Presented by Hans van de Mortel, Metafas, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

Metafas is a SME what produces printed electronics. There is a gap between production, development and usage. What are the challanges for production and what do designrules mean for production in relation to the costprice ? How do you produce printed electronics is a reasonable cheap production area? Continue reading “Printed electronics in practice for a SME – Presented by Hans van de Mortel, Metafas”

Printing of metal structures on 3D-printed polymer parts – Presented by Volker Zöllmer, Fraunhofer IFAM

Volker Zöllmer

Printing of metal structures on 3D-printed polymer parts – Presented by Volker Zöllmer, Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

Interview
What drives you?
New technologies, printed electronics, 3D-printing, digital transformation

What are the three things you would take with you on a deserted island?
3D-printer, Smartphone, picture of my family Continue reading “Printing of metal structures on 3D-printed polymer parts – Presented by Volker Zöllmer, Fraunhofer IFAM”

Integrated Electronic Functionalities in 3D Printed Products – Presented by Fabien Bruning, TNO

Fabien Bruning

Integrated Electronic Functionalities in 3D Printed Products – Presented by Fabien Bruning, TNO, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

Combining the flexibility of 3D printing techniques with technologies from flexible electronics creates a new manufacturing paradigm for products with integrated electronic functionalities. Free form is no longer only applicable to the structural part, but also to the embedded electronics. In this presentation we will showcase our development based on SLA (Stereo Lithography). With SLA high quality 3D products can be manufactured, yet the integration with other manufacturing technologies is more challenging than some other AM technologies. This presentation will focus on the challenges and our achievements in integrating electronic structures during the 3D printing processes.

Continue reading “Integrated Electronic Functionalities in 3D Printed Products – Presented by Fabien Bruning, TNO”

Semiconductor Processing Approach to Additive Manufacturing of Printed Electronics – Presented by Jaim Nulman, Nano Dimension

Jaim Nulman

Semiconductor Processing Approach to Additive Manufacturing of Printed Electronics – Presented by Jaim Nulman, Nano Dimension, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

Additive Manufacturing of printed electronics requires the deposition of both dielectric and conductive materials. These materials need to simultaneously comply with both electrical and mechanical requirements. While characterization of mechanical parameters for additive manufacturing is well understood, the electrical performance requires a fresh approach. In this presentation a semiconductor characterization and manufacturing view is presented as means of characterizing both the dielectric and conductive layers of printed electronics. Data shows how printing parameters affects the performance and how process conditions can be used to optimize electrical parameters. Continue reading “Semiconductor Processing Approach to Additive Manufacturing of Printed Electronics – Presented by Jaim Nulman, Nano Dimension”