Q5D Adding Electrical Function

Stephen Bennington

by Stephen Bennington, Q5D Technology Limited at Online 3D Printing Electronics Conference. REGISTER HERE to attend

Q5D’s technology is the fusion of two technologies: laser sintered printed, which makes it possible to print with copper or silver ink and then use a laser to cure and sinter the ink; and innovative 5-axis additive manufacturing which is able to accurately deposit inks or dielectrics.

This makes it possible to print conductive tracks on large curved surfaces or create complex structures with compact 3D circuitry for surface mounted components.

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3D Printed Electronics – be part of the ecosystem

by Corne Rentrop, Holst Centre

The printed electronics community is fastly growing. The latest actions involve high TRL work, aiming towards upscaling and industrialisation. This requires input from the complete value chain. Machine builders, materials and technology suppliers, are working with end-users to meet market specific requirements and allow industrialisation. The talk discusses how this is organised at the Holst Centre, complemented with some end-users examples.

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Printed electronics in practice for a SME – Presented by Hans van de Mortel, Metafas

Printed electronics in practice for a SME – Presented by Hans van de Mortel, Metafas, at the 3D Printing Electronics Conference, on January 28, at High Tech Campus Eindhoven, The Netherlands.

Metafas is a SME what produces printed electronics. There is a gap between production, development and usage. What are the challanges for production and what do designrules mean for production in relation to the costprice ? How do you produce printed electronics is a reasonable cheap production area? Continue reading “Printed electronics in practice for a SME – Presented by Hans van de Mortel, Metafas”

Inkjet-based fabrication of multilayer printed circuit boards with embedded printed passive elements

Vito Matteo Di Pietro

by Vito Matteo Di Pietro, Profactor GmbH

The project inkjetPCB has been recently publicly granted in the Eurostars program and started on the 1st of November 2019. Main scope of this project is to develop fully inkjet printed multi-layer Printed Circuit Boards (PCBs) including embedded passive components as a commercially viable process. As outcome of this collaborative innovation project, the consortium partners plan to deliver to their customers a “Complete Solution” for the digital additive manufacturing of PCBs including materials, equipment and process guidelines.

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3D printed electronics at Holst Centre, progress and challenges

hessel maalderink

by Hessel Maalderink, Holst Centre

There is a growing demand for printed (PCB-less!) electronic devices. Holst Centre is involved in various research programs (both shared and contract) targeted at developing technologies to enable production of such printed electronics.

The developments are triggered by the following drivers:

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3D printed electronics and AM at Würth – an insight of the strategy in the industry

Christian Robert

by Christian Robert, Würth Elektronik eiSos GmbH & Co. KG

Advanced Manufacturing is the key for future production in a digital world. With a focus on how 3D printing can be implemented in the electronic industry, Christian Robert gives some insights about the challenges to be solved and an outlook of future perspectives.

program: https://www.3dprintingelectronicsconference.com/program/

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Innovation Impulses in Printed Electronics through Cross-industrial Consortium Projects

Daniel Fuehren

by Daniel Fuehren, Project Manager, Innovation Impulses in Printed Electronics through Cross-industrial Consortium Projects, KEX Knowledge Exchange AG

The rapid development of additive manufacturing in recent years has reached the printed electronics sector. Besides the established 2D & 2.5D based techniques, also functionalized 3D-printed components are feasible now by utilizing new processes with unique and potentially disruptive properties for the smart products and services of the future.

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Roughness reduction and functional coating deposition on additive manufactured substrates with ultrasonic spray coating

wim deferme

by Wim Deferme, Hasselt University, Institute for Materials Research (IMO-IMOMEC)

Roughness of as-printed 3D parts is limiting the real breakthrough of Additive Manufacturing. Post processing technologies consist out of subtractive techniques such as grinding or sanding, or out of additive techniques such as coating.

In this presentation Ultrasonic Spray Coating as an additive post processing technologie is described to first of all reduce the roughness of Selective Laser Sintered substrates down to less than 2 micrometer and further, functional formulations consisting out of a polymer and nanoparticles is prepared to not only reduce the roughness but also add functionalities to the surface of the 3D substrate such as scratch resistance or superhydrophobicity.

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