Printed Stretchable Circuits: A breakthrough – Presented by Mahmoud Tavakoli, Institute of Systems and Robotics

Mahmoud Tavakoli

Printed Stretchable Circuits: A breakthrough – Presented by Mahmoud Tavakoli, Institute of Systems and Robotics, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

In this talk I will cover a series of novel methods and materials for printing stretchable circuits. We created the first ever method for inkjet printing of highly stretchable circuits, and then we adapted this method for laser printing or screen printing methods. Circuits are instantly sintered at room temperature, without requiring temperature or light pulses, and at the same time the circuits become highly stretchable. I will show applications of this method for rapid prototyping of ultrathin e-skin, as an electronic tattoo for biomonitoring or circuits that are transferred over 3D objects to enable tactile input, proximity detection, pressure detection or other applications. Finally i will present a stretchable conductive ink and adhesive which allows direct writing of stretchable circuits. Continue reading “Printed Stretchable Circuits: A breakthrough – Presented by Mahmoud Tavakoli, Institute of Systems and Robotics”

Martin Hedges, Neotech AMT, will speak at 3D Printing Electronics Conference

Martin Hedges

Martin Hedges, Neotech AMT, will speak at 3D Printing Electronics Conference, which will take place on January 22, 2019, at High Tech Campus Eindhoven.

About Dr. Martin Hedges
Graduated BSc (Materials Science) from the University of Manchester (UK) in 1987. Completed a PhD in Materials Science in 1990 from UMIST (UK).

Founded the company Neotech in Nuremberg in 2001 to develop additive manufacturing processes with a focus on Printed Electronics. Continue reading “Martin Hedges, Neotech AMT, will speak at 3D Printing Electronics Conference”

Printed electronics in practice for a SME – Presented by Hans van de Mortel, Metafas

Hans van de Mortel

Printed electronics in practice for a SME – Presented by Hans van de Mortel, Metafas, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

Metafas is a SME what produces printed electronics. There is a gap between production, development and usage. What are the challanges for production and what do designrules mean for production in relation to the costprice ? How do you produce printed electronics is a reasonable cheap production area? Continue reading “Printed electronics in practice for a SME – Presented by Hans van de Mortel, Metafas”

Technologische Ontwikkeling Is Media Partner of 3D Printing Electronics Conference

Technologische Ontwikkeling

Technologische Ontwikkeling Is Media Partner of 3D Printing Electronics Conference, which will take place on January 22, 2019, at High Tech Campus Eindhoven, The Netherlands.

About Technologische Ontwikkeling
Technologische Ontwikkeling is the corresponding website for all technologically related publications of MediaPlanet.

Mediaplanet creates useful content that educates our audience and positions our clients as solution providers Continue reading “Technologische Ontwikkeling Is Media Partner of 3D Printing Electronics Conference”

Printing of metal structures on 3D-printed polymer parts – Presented by Volker Zöllmer, Fraunhofer IFAM

Volker Zöllmer

Printing of metal structures on 3D-printed polymer parts – Presented by Volker Zöllmer, Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

Interview
What drives you?
New technologies, printed electronics, 3D-printing, digital transformation

What are the three things you would take with you on a deserted island?
3D-printer, Smartphone, picture of my family Continue reading “Printing of metal structures on 3D-printed polymer parts – Presented by Volker Zöllmer, Fraunhofer IFAM”

Advances in 3D-printed supercapacitor technology could lead to wider use

supercapacitor

Advances in 3D-printed supercapacitor technology could lead to wider use use of fast-charging energy storage devices and novel designs for electronic gadgets.

Scientists at UC Santa Cruz and Lawrence Livermore National Laboratory (LLNL) have reported unprecedented performance results for a supercapacitor electrode. The researchers fabricated electrodes using a printable graphene aerogel to build a porous three-dimensional scaffold loaded with pseudocapacitive material. Continue reading “Advances in 3D-printed supercapacitor technology could lead to wider use”

Integrated Electronic Functionalities in 3D Printed Products – Presented by Wijnand Germs, TNO

Wijnand Germs

Integrated Electronic Functionalities in 3D Printed Products – Presented by Wijnand Germs, TNO, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

Combining the flexibility of 3D printing techniques with technologies from flexible electronics creates a new manufacturing paradigm for products with integrated electronic functionalities. Free form is no longer only applicable to the structural part, but also to the embedded electronics. In this presentation we will showcase our development based on SLA (Stereo Lithography). With SLA high quality 3D products can be manufactured, yet the integration with other manufacturing technologies is more challenging than some other AM technologies. This presentation will focus on the challenges and our achievements in integrating electronic structures during the 3D printing processes. Continue reading “Integrated Electronic Functionalities in 3D Printed Products – Presented by Wijnand Germs, TNO”

Semiconductor Processing Approach to Additive Manufacturing of Printed Electronics – Presented by Jaim Nulman, Nano Dimension

Jaim Nulman

Semiconductor Processing Approach to Additive Manufacturing of Printed Electronics – Presented by Jaim Nulman, Nano Dimension, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

Additive Manufacturing of printed electronics requires the deposition of both dielectric and conductive materials. These materials need to simultaneously comply with both electrical and mechanical requirements. While characterization of mechanical parameters for additive manufacturing is well understood, the electrical performance requires a fresh approach. In this presentation a semiconductor characterization and manufacturing view is presented as means of characterizing both the dielectric and conductive layers of printed electronics. Data shows how printing parameters affects the performance and how process conditions can be used to optimize electrical parameters. Continue reading “Semiconductor Processing Approach to Additive Manufacturing of Printed Electronics – Presented by Jaim Nulman, Nano Dimension”