Hybrid printed electronics on tridimensional objects – Presented by Claudia Delgado Simao, Fundació Eurecat

Hybrid printed electronics on tridimensional objects – Presented by Claudia Delgado Simao, Fundació Eurecat at the 3D Printing Electronics Conference, which takes place on Jan 23, 2018 at High Tech Campus Eindhoven in The Netherlands. Hybrid printed electronics technology has shown the potential to combine compact high-performance circuits over all type of materials, from rigid metals… [read more]

Design Toolchain and Slicing Process for the Integration of Electronics into FDM Printed Objects – Presented by Florens Wasserfall, University of Hamburg

Design Toolchain and Slicing Process for the Integration of Electronics into FDM Printed Objects – Presented by Florens Wasserfall, University of Hamburg at the 3D Printing Electronics Conference, which takes place on Jan 23, 2018 at High Tech Campus Eindhoven in The Netherlands. The integration of wires and electronic components into additive fabrication processes has… [read more]

Packaging of electronic devices using 3D printing technology – Presented by Gabrielle Aspar, LETI, CEA Grenoble

Packaging of electronic devices using 3D printing technology – Presented by Gabrielle Aspar, LETI, CEA Grenoble at the 3D Printing Electronics Conference, which takes place on Jan 23, 2018 at High Tech Campus Eindhoven in The Netherlands. In this paper we present a new approach for building specific packaging that is scalable, versatile and could… [read more]

Dimensional Control & Process Assembly for 3D Electronics at Industrial Scale – Presented by Yu Liu, Jiangnan University

Dimensional Control and Process Assembly for 3D Electronics at Industrial Scale – Presented by Yu Liu, Institute of Precision Intelligent System Engineering (iPISE), School of Mechanical Engineering, Jiangnan University at the 3D Printing Electronics Conference, which takes place on Jan 23, 2018 at High Tech Campus Eindhoven in The Netherlands. In this speech, development of… [read more]

Creating the Uber of Consumer Electronic Product Manufacturing – Presented by Senake Atureliya, Buzz Technology Limited

Creating the Uber of Consumer Electronic Product Manufacturing – Presented by Senake Atureliya, Buzz Technology Limited at the 3D Printing Electronics Conference, which takes place on Jan 23, 2018 at High Tech Campus Eindhoven in The Netherlands. Crowd funding has given us the Occulus Rift and VR, Pebble and the smart watch. Peer-to-peer marketplaces such… [read more]

Fraunhofer ILT’s LaserTAB Combines Welding, 3D Printing and Robotics

Fraunhofer ILT’s LaserTAB Combines Welding, 3D Printing and Robotics At the productronica trade fair in Munich this November, the Fraunhofer Institute for Laser Technology ILT will be presenting Laser-Based Tape-Automated Bonding, LaserTAB for short. The experts from Aachen will be demonstrating how new battery cells and power electronics can be micro-welded more efficiently and precisely… [read more]

3D print your complete mobile phone to your requirements – Interview with Stefan Rink, Shapeways

3D print your complete mobile phone to your requirements – Interview Stefan Rink, Shapeways Turning today’s content into tomorrow’s products Shapeways factories focus on scalability of the 3D printing ecosystem that enables people to create the final products they want. “With 10 million orders under our belt, Shapeways is at the forefront of leveraging the… [read more]