presentation by Leo Schranzhofer, Project Manager / Research Scientist, Profactor GmbH, at ONLINE 3D Printing Electronics Conference (21 January 2021, 15:00 – 19:00 CET). REGISTER HERE to attend the conference
This H2020 project, coordinated by Leo Schranzhofer, PROFACTOR, started at 01.10.2020. Notion Systems and PV nanocell are partners in the consortium and will be mentioned in the talk.
Continue reading “Sensor package fabrication via additive manufacturing for automotive sector – An introduction to the TINKER project”
by Stephen Bennington, Q5D Technology Limited at Online 3D Printing Electronics Conference. REGISTER HERE to attend
Q5D’s technology is the fusion of two technologies: laser sintered printed, which makes it possible to print with copper or silver ink and then use a laser to cure and sinter the ink; and innovative 5-axis additive manufacturing which is able to accurately deposit inks or dielectrics.
This makes it possible to print conductive tracks on large curved surfaces or create complex structures with compact 3D circuitry for surface mounted components.
Continue reading “Q5D Adding Electrical Function”
Neotech AMT GmbH is one of the leading companies developing systems for 3D Printed Electronics (3D PE). The company began developing this novel technology in 2006 and installed the worlds first 5 axis 3D PE system in 2010. This system expertly combines hard- and software elements into a unique solution capable of production complex circuitry on almost any 3D surface.
Continue reading “Neotech AMT is Gold Partner of Online 3D Printing Electronics Conference”
JakajimaTV interview with Martin Hedges, Owner of Neotech AMT Gmbh, hosted by Pieter Hermans gives a clear overview about the possibilities 3D Printing Electronics offers.
Continue reading “3D Printing Electronics offers 3Dimensional alternatives for Printed Circuit Boards”
by Julia Veldhuijzen van Zanten, Creative Director, LifeSense Group
How the use of flexible electronics is changing users wearable experience in healthcare.
Continue reading “Flexible electronics in healthcare wearables”
by Corne Rentrop, Holst Centre
The printed electronics community is fastly growing. The latest actions involve high TRL work, aiming towards upscaling and industrialisation. This requires input from the complete value chain. Machine builders, materials and technology suppliers, are working with end-users to meet market specific requirements and allow industrialisation. The talk discusses how this is organised at the Holst Centre, complemented with some end-users examples.
Continue reading “3D Printed Electronics – be part of the ecosystem”
by Henk van Broekhuyzen, Senior Process Development Engineer, DoMicro
A presentation about the ongoing work at DoMicro in the field of inkjet printed electronics. Going beyond conducting lines
Continue reading “DoMicro: inkjet printing 2.5D electronics”
Printed electronics in practice for a SME – Presented by Hans van de Mortel, Metafas, at the 3D Printing Electronics Conference, on January 28, at High Tech Campus Eindhoven, The Netherlands.
Metafas is a SME what produces printed electronics. There is a gap between production, development and usage. What are the challanges for production and what do designrules mean for production in relation to the costprice ? How do you produce printed electronics is a reasonable cheap production area? Continue reading “Printed electronics in practice for a SME – Presented by Hans van de Mortel, Metafas”
3D Printing Electronics Conference welcomes Printed Electronics Netherlands as Bronze Partner
About Printed Electronics Netherlands
Since 2014 an Ecosystem for Printed Electronics has been built in the Netherlands consisting of research institutions, SMEs, Universities, Corporates, governmental institutions and technology consultants.
Continue reading “Printed Electronics Netherlands is Bronze Partner of 3D Printing Electronics Conference 2020”
by Vito Matteo Di Pietro, Profactor GmbH
The project inkjetPCB has been recently publicly granted in the Eurostars program and started on the 1st of November 2019. Main scope of this project is to develop fully inkjet printed multi-layer Printed Circuit Boards (PCBs) including embedded passive components as a commercially viable process. As outcome of this collaborative innovation project, the consortium partners plan to deliver to their customers a “Complete Solution” for the digital additive manufacturing of PCBs including materials, equipment and process guidelines.
Continue reading “Inkjet-based fabrication of multilayer printed circuit boards with embedded printed passive elements”