The 5th edition of the 3D Printing Electronics Conference took place on January 23, 2018, at High Tech Campus Eindhoven, The Netherlands.
The conference attracted over 70 international delegates and provided great intellectual and social interaction to all participants.
The program featured 10 internationally renowned speakers from SABIC, Buzz Technology, PwC, TNO, CEA-LETI, Fundacio Eurecat, Neotech, adphos, University of Hamburg, who shared their knowledge and expertise on a variety of topics related to 3D Printing Electronics.
The discussions focused on topics such as the “Uberisation Era” of Consumer Electronic Product Manufacturing, Packaging of electronic devices using 3D printing, Dimensional Control and Process Assembly for 3D Electronics at Industrial Scale, In-mould Electronics: from rigid PCB to 3D and flexible, Hybrid printed electronics on 3D objects and many more. Read more
On January 24, 2017, the 4th edition of the 3D Printing Electronics Conference was held at High Tech Campus in Eindhoven, The Netherlands.
The conference attracted over 90 international delegates and provided great intellectual and social interaction to all participants.
In the morning, Martin Hedges from Neotech AMT spoke about the convergence of 3D Printing and 3D Printed Electronics, while Rob van Asselt, Philips Lighting Research, tackled the opportunities and challenges of integrating 3D electronics in lighting products.
After that, Kathrin Reinhardt from Fraunhofer Institute for Ceramic Technologies and Systems IKTS showed how better printing quality of the pastes can be obtained, so that there is a higher reliability for 3D printed electronics. Read more
The 3rd edition of the 3D Printing Electronics Conference took place on January 19th, 2016, at High Tech Campus, in Eindhoven, The Netherlands.
The conference was successful, attracting over 70 international delegates, and provided great intellectual and social interaction for the participants.
This year’s conference included insights from Germany’s Nanotech AMT, whose expertise includes moulded Interconnect Devices, high efficiency printed mobile phone antennas, or the creation of heater patterns on materials such as PC for automotive applications. TNO explained how integrating electronics into loadbearing or protective structures, means “dumb” plastic parts can be made smart. Different techniques like thermoforming and inmold were explained. Read more
The seminar program of the second edition of the 3D Printing Electronics Conference Read more
The wide variety of topics around 3D printing and electronics has made the 3D Printing Electronics Conference to a success. The companies TNO, Neotech AMT GmbH, Holst Centre, CERADROP and University of Warwick succeeded to inspire the (inter)national attendees with their enthralling presentations, in which different views and technologies were introduced. We can look back on a successful day full of innovation, inspiration and networking! Read more