Block copolymers: a route for 4D printing

presentation by Claudia Delgado Simao, Teamleader at Eurecat – Technology Centre of Catalonia, at ONLINE 3D Printing Electronics Conference (21 January 2021, 14:00 – 18:00 CET). REGISTER HERE to attend the conference

4D printing is a methodology that makes use of a certain printed material property to change it’s final structure or chemistry along time. Block-copolymers (BCP) are synthetic polymer materials with tuned supramolecular interactions by design, useful to control it’s ability to self-assemble in segregated hydrophillic-hydrophonbic domains and create various functionalised superstructures. Here is presented the methodology for 4DP with BCPs and potential applications in health and energy applications.



What drives you?

Spontaneously ordered materials, printed technology, antimicrobial applications

Why should the delegate attend your presentation?

Methodology to implement BCPs in different 3D printing and planar printing technology

What emerging technologies/trends do you see as having the greatest potential in the short and long run?

Antimicrobial applications, sterile surfaces, microbial fuel cells

What kind of impact do you expect them to have?

New 4DP routes

What are the barriers that might stand in the way?

Pattern stability

Claudia Delgado Simao is a group leader at Fundació Eurecat. She obtained her MSc degree in Chemistry by Universidade Técnica de Lisboa (Portugal) in 2007. She obtained her PhD thesis by Universitat Autonoma de Barcelona (Spain) in 2011. Her research interests span over materials science, self-assembly, organic electronics, surface engineering and printing technology, focusing in ink development, device design and surface engineering for human-machine interfaces and medical applications.

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The 3D Printing Electronics Conference is a platform and information interface enabling an exchange of informations on market requirements, research interests and current results, skills and resources as well as facilitating the building of future partnerships. Academics, engineers, designers, and managers are invited to lecture on their state-of-the-art developments and future prospects or display their products and offers as exhibitor. The conference focuses on various aspects involving (3D) printed electronics such as: combining functional elements such as electronics (sensors or switches) into a (3D) printed product hybrid / printed circuit boards, processes that integrate electronics onto or within 3D printed parts, 3D Printed Optics / Photonics, Challenges for manufacturers / engineers / researchers and Future prospects.