Design Toolchain and Slicing Process for the Integration of Electronics into FDM Printed Objects – Presented by Florens Wasserfall, University of Hamburg at the 3D Printing Electronics Conference, which takes place on Jan 23, 2018 at High Tech Campus Eindhoven in The Netherlands.
The integration of wires and electronic components into additive fabrication processes has recently been demonstrated by a number of research groups. However, the overall design flow, from initial schematics capture to component placement, process compatible wire routing, and generation of slicing toolpaths remains an important, yet unsolved problem.
In this talk, we present a full toolchain to design and print 3D-electronics with a modified FDM printer. The focus lies on a modified slicer which imports both the 3D CAD model and a common EAGLE PCB schematic. The user works in a 3D representation of the final extruder toolpath, augmented by the routing information.
About Florens Wasserfall
Florens Wasserfall works as a research associate at the Department of Informatics, University of Hamburg. He started working with 3D-printers in 2011, received his master’s degree in 2014 on adaptive slicing algorithms for FMD-printing and has developed a strong interest in integration of electronics and sensors into 3D-printed parts.
About University of Hamburg
The additive-manufacturing research-lab is part of the intelligent robotics group and co-located with the RoboCup team, providing a broad range of real applications and integration.
About 3D Printing Electronics Conference
The 3D Printing Electronics Conference will take place on January 23, 2018, at High Tech Campus Eindhoven, The Netherlands.
Various aspects involving (3D) printed electronics, such as:
combining functional elements such as electronics (sensors or switches) into a (3D) printed product hybrid
processes that integrate electronics onto or within 3D printed parts
3D Printed Optics / Photonics
Challenges for manufacturers / engineers / researchers
Future prospects / applications
Who should attend?
Decision makers in the industrial value chain, such as CTO’s and COO’s of OEMs, managers of (high tech) suppliers and subcontractors; Procurement management; Investors; Design & engineering experts; Professionals involved in developing electronic products, such as product designers, engineers, product managers, (consumer) electronics manufacturers, software developers and ‘internet of things’ system integrators; Anyone curious about new technologies and developments in the (3D)printing electronics/optics/photonics industry