Dimensional Control & Process Assembly for 3D Electronics at Industrial Scale – Presented by Yu Liu, Jiangnan University

Dimensional Control and Process Assembly for 3D Electronics at Industrial Scale – Presented by Yu Liu, Institute of Precision Intelligent System Engineering (iPISE), School of Mechanical Engineering, Jiangnan University at the 3D Printing Electronics Conference, which takes place on Jan 23, 2018 at High Tech Campus Eindhoven in The Netherlands.

In this speech, development of automated printing platform, which owns high – level capability for direct fabrication of 3D electronics, will be given. Emphasizes will be on process control for precise dimensioning of ink based filaments and function deposition. We are going to deliver something which local industrial partners are thinking about. For devices, I will share with direct fabrication of highly stretchable strain sensor and smart cushion with sensing capabilities. Final remarks will be given on how far to integrate intelligence from different printing engineering for more complex implementation.

About Yu Liu
With B.E., M.Sc., PhD. in control science, mechanical and materials engineering, respectively, Dr. Liu has achieved > 50 publications and >70 patents. His both academic and industrial researches with different sectors from transport, energy, building, and environment, are leading his group for establishing optimal solutions to the emerging 3D mechatronics.

About Institute of Precision Intelligent System Engineering (iPISE), School of Mechanical Engineering, Jiangnan University
Established at the January of 2017, iPISE has quickly developed, through having interacted with doses of local partners and built its increasing local impact on 3D printed electronics, esp. on equipment and instrumentation & control. The members from mechanical, software, electrical and materials are developing higher performance 3D devices.

3D Printing ElectronicsAbout 3D Printing Electronics Conference
The 3D Printing Electronics Conference will take place on January 23, 2018, at High Tech Campus Eindhoven, The Netherlands.

Focus topics:
Various aspects involving (3D) printed electronics, such as:
combining functional elements such as electronics (sensors or switches) into a (3D) printed product hybrid
processes that integrate electronics onto or within 3D printed parts
3D Printed Optics / Photonics
Challenges for manufacturers / engineers / researchers
Future prospects / applications

Who should attend?
Decision makers in the industrial value chain, such as CTO’s and COO’s of OEMs, managers of (high tech) suppliers and subcontractors; Procurement management; Investors; Design & engineering experts; Professionals involved in developing electronic products, such as product designers, engineers, product managers, (consumer) electronics manufacturers, software developers and ‘internet of things’ system integrators; Anyone curious about new technologies and developments in the (3D)printing electronics/optics/photonics industry