Flexible and Conformable Electronics for Next-Generation Devices

presentation by Shweta Argawala, Tenure-Track Assistant Professor, Aarhus University at ONLINE 3D Printing Electronics Conference (21 January 2021, 14:00 – 18:00 CET). REGISTER HERE to attend the conference

Moving forward biomedical devices will require materials and platforms that have Young’s modulus closer to human skin. Direct writing of electronics using functional inks on flexible, stretchable and biocompatible substrates will open doors for innovation in biomedical and health technology. This will tackle the issues of immune reactions and scarring of tissue that hamper the successful use of implantable devices for longer durations.

I will talk about our research on developing novel functional inks for electronic applications that can be directly written on unconventional substrates to enable next-generation devices. The focus is to understand the ink-substrate interactions to print homogeneous and high-resolution circuits.

I will also discuss various application areas, where printed electronics is pushing design innovation for sustainable and biodegradable electronics.

program: https://www.3dprintingelectronicsconference.com/program/

Interview

What drives you?

Vision to customize and put electronics everywhere I want.

Why should the delegate attend your presentation?

To know how PCB-free and flexible electronics components can be fabricated on unconventional substrates

What emerging technologies/trends do you see as having the greatest potential in the short and long run?

Printed Electronics, Biodegradable Electronics

What kind of impact do you expect them to have?

Impact on next-generation biomedical devices, soft robotics and intelligent textiles

What are the barriers that might stand in the way?

Challenges exist in material inks, printing techniques and power management

The 3D Printing Electronics Conference is a platform and information interface enabling an exchange of informations on market requirements, research interests and current results, skills and resources as well as facilitating the building of future partnerships. Academics, engineers, designers, and managers are invited to lecture on their state-of-the-art developments and future prospects or display their products and offers as exhibitor. The conference focuses on various aspects involving (3D) printed electronics such as: combining functional elements such as electronics (sensors or switches) into a (3D) printed product hybrid / printed circuit boards, processes that integrate electronics onto or within 3D printed parts, 3D Printed Optics / Photonics, Challenges for manufacturers / engineers / researchers and Future prospects.