Hybrid electronics integration by inkjet technology – Presented by Marcel Grooten, DoMicro BV, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.
DoMicro BV has progressed in advanced packaging and integration of conventional electronics in flexible foils structures. Printing multi-layers, passive components and interconnection of thinned silicon dies is enabled by revolutionary developments in nano-printing and specific inkjet technology. Several examples will be discussed including a functional flexible microsensor application.
What drives you?
Building high tech companies by walking new technology roads near to the end of the rainbow
What are the three things you would take with you on a deserted island?
Why go there?
What emerging technologies/trends do you see as having the greatest potential in the short and long run?
Renewal energy and G5 connectivity
What kind of impact do you expect them to have?
Free and sustainable energy and data supply
What are the barriers that might stand in the way?
Politics & climate change
Why should the delegate attend your presentation?
Get latest update on flexible hybrid electronics
Technology creation is a long term steady, consistent and persistent teamwork effort
About Marcel Grooten
As Managing Director for DoMicro BV, Marcel Grooten MSc. drives the industrialisation of new production technology for flexible hybrid electronics. After graduation he started his career within Royal Philips Electronics NV, acquiring skills in equipment engineering, project management, human resources and operations. Hereafter he has been engaged in several start-up companies.
His leadership and entrepreneurship is based on many years of profound knowledge, international experience and network in technical consultancy and operational executive management.
About DoMicro BV
DoMicro BV is a high-tech provider creating value by additive technologies in electronic manufacturing. DoMicro develops inkjet printing processes for flexible hybrid and printed electronics.
The company delivers R&D services, small series production, system architecture and project management for customers exploring new emerging markets. The flexible hybrid electronics market is growing rapidly due to the increased demand for integrated wireless electronics and applications like IoT, wearables and sensors in flexible form factors.
About 3D Printing Electronics Conference
The 3D Printing Electronics Conference will take place on January 22, 2019, at High Tech Campus Eindhoven, The Netherlands.
Various aspects involving (3D) printed electronics, such as:
combining functional elements such as electronics (sensors or switches) into a (3D) printed product hybrid
processes that integrate electronics onto or within 3D printed parts
3D Printed Optics / Photonics
Challenges for manufacturers / engineers / researchers
Future prospects / applications
Who should attend?
Decision makers in the industrial value chain, such as CTO’s and COO’s of OEMs, managers of (high tech) suppliers and subcontractors; Procurement management; Investors; Design & engineering experts; Professionals involved in developing electronic products, such as product designers, engineers, product managers, (consumer) electronics manufacturers, software developers and ‘internet of things’ system integrators; Anyone curious about new technologies and developments in the (3D)printing electronics/optics/photonics industry