Hybrid printed electronics on 3D objects – Presented by Mohammad Mashayekhi, Fundació Eurecat at the 3D Printing Electronics Conference, which takes place on Jan 23, 2018 at High Tech Campus Eindhoven in The Netherlands.
Hybrid printed electronics technology has shown the potential to combine compact high-performance circuits over all type of materials, from rigid metals to lightweight materials, composites polymers, and textile or elastic substrates. Has been attracting major attention with the dawn of Internet of Things, as an enabler to embed autonomous active circuits on portable objects with privacy labels, luminesce elements, biocompatible energy storage with printed batteries on papers, photovoltaic devices, optoelectronic, sensing devices, and NFC communication tags. Our recent work focus two main approaches for preparing 3D printed electronics: printing via ultrasonic microspraycoating and thermoforming printed circuits on foils.
About Mohammad Mashayekhi
Mohammad Mashayekhi (Ph.D. 2016) is a senior scientist in Eurecat Technology Centre, Spain. In 2017, he obtained a Master in Project Management, aimed for leading projects based on Project Management Institute processes and standards. He has participated and lead several R&D projects related to Printed & haybrid Electronics, addressing its real-world applications (sensors, smart objects, RFID tags, flexible displays, etc.) and (co)-authored several publications.
About Fundació Eurecat
Fundació EURECAT is the biggest technological center in Catalunya region in Spain. It’s positioned towards seven key strategic areas: food, energy and resources, industrial systems; sustainable mobility; design-based, health, and cultural, experience-based industries. Participates in over 100 national and international R&D&i strategic projects, has 73 patents and 9 technology-based companies.
About 3D Printing Electronics Conference
The 3D Printing Electronics Conference will take place on January 23, 2018, at High Tech Campus Eindhoven, The Netherlands.
Various aspects involving (3D) printed electronics, such as:
combining functional elements such as electronics (sensors or switches) into a (3D) printed product hybrid
processes that integrate electronics onto or within 3D printed parts
3D Printed Optics / Photonics
Challenges for manufacturers / engineers / researchers
Future prospects / applications
Who should attend?
Decision makers in the industrial value chain, such as CTO’s and COO’s of OEMs, managers of (high tech) suppliers and subcontractors; Procurement management; Investors; Design & engineering experts; Professionals involved in developing electronic products, such as product designers, engineers, product managers, (consumer) electronics manufacturers, software developers and ‘internet of things’ system integrators; Anyone curious about new technologies and developments in the (3D)printing electronics/optics/photonics industry