Integrated Electronic Functionalities in 3D Printed Products – Presented by Fabien Bruning, TNO

Integrated Electronic Functionalities in 3D Printed Products – Presented by Fabien Bruning, TNO, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

Combining the flexibility of 3D printing techniques with technologies from flexible electronics creates a new manufacturing paradigm for products with integrated electronic functionalities. Free form is no longer only applicable to the structural part, but also to the embedded electronics. In this presentation we will showcase our development based on SLA (Stereo Lithography). With SLA high quality 3D products can be manufactured, yet the integration with other manufacturing technologies is more challenging than some other AM technologies. This presentation will focus on the challenges and our achievements in integrating electronic structures during the 3D printing processes.

What drives you?
As a mechanical engineer at hearth, my passsion is creating new equipment and machines.

What are the three things you would take with you on a deserted island?
Satphone, survival kit and a seaplane.

What emerging technologies/trends do you see as having the greatest potential in the short and long run?
Additive manufacturing, nuclear fusion

What kind of impact do you expect them to have?
AM is growing from prototypes to production systems and will have a huge impact on all industries. In the long term, nuclear fusion could yield true energy independence.

What are the barriers that might stand in the way?
New technologies are always encountering barriers, be they fundamental or economic ones.

Why should the delegate attend your presentation?
To get an update on the progress towards 3D printed electronics with freeform 3D shape and electrical conductors.

“Special Quote”
Theory and practice always differ more in practice than in theory.

About TNO
TNO connects people and knowledge to create innovations that boost the competitive strength of industry and the well-being of society in a sustainable way. This is our mission and it is what drives us, the over 3,200 professionals at TNO, in our work every day. We work in collaboration with partners and focus on nine domains.

About AMSYSTEMS Center – Innovation by TNO and TU/e HTSC
The AMSYSTEMS Center is a joint innovation center of TNO and the High Tech Systems Center of Eindhoven University of Technology (TU/e HTSC) to accelerate (new ways of) additive manufacturing in diverse industries. Therefore the AMSYSTEMS Center focuses on:

The development of next generation multi-material/multi-technology AM equipment,
The integration of AM technologies towards mass-customization production chains, enabling the industry to step up to Next Generation Manufacturing.

About 3D Printing Electronics Conference
The 3D Printing Electronics Conference will take place on January 22, 2019, at High Tech Campus Eindhoven, The Netherlands.

Focus topics:
Various aspects involving (3D) printed electronics, such as:
combining functional elements such as electronics (sensors or switches) into a (3D) printed product hybrid
processes that integrate electronics onto or within 3D printed parts
3D Printed Optics / Photonics
Challenges for manufacturers / engineers / researchers
Future prospects / applications

Who should attend?
Decision makers in the industrial value chain, such as CTO’s and COO’s of OEMs, managers of (high tech) suppliers and subcontractors; Procurement management; Investors; Design & engineering experts; Professionals involved in developing electronic products, such as product designers, engineers, product managers, (consumer) electronics manufacturers, software developers and ‘internet of things’ system integrators; Anyone curious about new technologies and developments in the (3D)printing electronics/optics/photonics industry