In-mould Electronics: from rigid PCB to 3D and flexible – Presented by Janaina de Castro, SABIC

In-mould Electronics: from rigid PCB to 3D and flexible – Presented by Janaina de Castro, SABIC at the 3D Printing Electronics Conference, which takes place on Jan 23, 2018 at High Tech Campus Eindhoven in The Netherlands.

In-mould Electronics (IME) is a technology that enables new design possibilities, space optimization and innovative features. It incorporates electronics in a plastic part. Benefits of IME technology:

  • One-piece design combining decorative surface and electronics
  • Surface functionalization: encapsulated sensors, antennas, haptics and more
  • Weight saving
  • Assembly simplification and electronics protection

About Janaina de Castro
Bachelor´s degree in Chemistry at University of Campinas, Brazil. Master degree and specialization in Plastics at Politecnico di Torino, Italy. PhD degree in Physics at University of Amsterdam, The Netherlands. Since 2014 I´m working at SABIC in the commercial area. In May 2017 I joined the Business Development team under the High Heat product portfolio

About SABIC
SABIC is composed of four strategic business units – Petrochemicals, Specialties, Agri-Nutrients, and Metals – each headed by an Executive Vice President. They support customers by identifying and developing opportunities in key end markets such as construction, medical devices, packaging, agri-nutrients, electrical and electronics, transportation and clean energy.

3D Printing ElectronicsAbout 3D Printing Electronics Conference
The 3D Printing Electronics Conference will take place on January 23, 2018, at High Tech Campus Eindhoven, The Netherlands.

Focus topics:
Various aspects involving (3D) printed electronics, such as:
combining functional elements such as electronics (sensors or switches) into a (3D) printed product hybrid
processes that integrate electronics onto or within 3D printed parts
3D Printed Optics / Photonics
Challenges for manufacturers / engineers / researchers
Future prospects / applications

Who should attend?
Decision makers in the industrial value chain, such as CTO’s and COO’s of OEMs, managers of (high tech) suppliers and subcontractors; Procurement management; Investors; Design & engineering experts; Professionals involved in developing electronic products, such as product designers, engineers, product managers, (consumer) electronics manufacturers, software developers and ‘internet of things’ system integrators; Anyone curious about new technologies and developments in the (3D)printing electronics/optics/photonics industry.