Packaging of electronic devices using 3D printing technology – Presented by Gabrielle Aspar, LETI, CEA Grenoble

Packaging of electronic devices using 3D printing technology – Presented by Gabrielle Aspar, LETI, CEA Grenoble at the 3D Printing Electronics Conference, which takes place on Jan 23, 2018 at High Tech Campus Eindhoven in The Netherlands.

In this paper we present a new approach for building specific packaging that is scalable, versatile and could be potentially cost competitive. Using polymer additive manufacturing, more commonly known as 3D printing, we set out to build customized structures and packages perfectly adapted to component dimensions and specifications. Two different 3D printing technologies, respectively called stereolithography and Fused Deposition Molding, were studied. The work described in this paper opens plenty of new approaches: device design with a customizable backend packaging process, packaging adapted to each different component, even on the same device, fast device prototyping with accurate characteristics, among others.

About Gabrielle Aspar
Graduated from an engineering school (ECAM Rennes) and mechanic and civil engineering research master (INSA Rennes) in 2015. I currently do a PhD at the CEA- LETI Grenoble. My PhD topic is: 3D printing packaging for electronic devices.

About LETI, CEA Grenoble
LETI, a technology research institute at CEA Tech, pioneers micro and nanotechnologies, tailoring differentiating applicative solutions that ensure competitiveness in a wide range of markets. The institute tackles critical challenges such as healthcare, energy, transport and ICTs.

3D Printing ElectronicsAbout 3D Printing Electronics Conference
The 3D Printing Electronics Conference will take place on January 23, 2018, at High Tech Campus Eindhoven, The Netherlands.

Focus topics:
Various aspects involving (3D) printed electronics, such as:
combining functional elements such as electronics (sensors or switches) into a (3D) printed product hybrid
processes that integrate electronics onto or within 3D printed parts
3D Printed Optics / Photonics
Challenges for manufacturers / engineers / researchers
Future prospects / applications

Who should attend?
Decision makers in the industrial value chain, such as CTO’s and COO’s of OEMs, managers of (high tech) suppliers and subcontractors; Procurement management; Investors; Design & engineering experts; Professionals involved in developing electronic products, such as product designers, engineers, product managers, (consumer) electronics manufacturers, software developers and ‘internet of things’ system integrators; Anyone curious about new technologies and developments in the (3D)printing electronics/optics/photonics industry