Printing of metal structures on 3D-printed polymer parts – Presented by Volker Zöllmer, Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.
What drives you?
New technologies, printed electronics, 3D-printing, digital transformation
What are the three things you would take with you on a deserted island?
3D-printer, Smartphone, picture of my family
What emerging technologies/trends do you see as having the greatest potential in the short and long run?
Short time: 3D-printing, lomg time: BigData
What kind of impact do you expect them to have?
BigData will be the “new oil”
What are the barriers that might stand in the way?
“We have always done so”
Why should the delegate attend your presentation?
We show an interesting approach of how to combine 3D-printing and printed electronics
About Volker Zöllmer
Study of Chemistry and Mineralogy, Diploma as Mineralogist in 1999, University of Kiel, Germany
PhD in 2002, Title of work: „Diffusion in glasbildenden Palladium-Kupfer-Nickel-Phosphorlegierungen vom Glaszustand bis in die Gleichgewichtsschmelze“ at University of Kiel, Germany
2002: Award “DGM-Nachwuchspreis 2002” by “Deutsche Gesellschaft für Materialkunde (DGM)”.
2002: Engagement at Fraunhofer IFAM, Bremen, Germany, Project Manager “Metallic foams”
2003: Head of „Functional Printing“ Department at Fraunhofer IFAM
2014: “IDTechEX Academic R&D Award” for printed thermoelectric devices
2018: Head of “Smart Systems” Department at Fraunhofer IFAM
The Fraunhofer IFAM is one of the most important research institutions in Europe for adhesive bonding technology, surfaces, shaping and functional materials. At our institute’s five locations – Bremen, Dresden, Oldenburg, Stade and Wolfsburg – we put our central principles into practice: scientific excellence, a focus on the application of technology, measurable utility for customers and ensuring the highest quality.
About 3D Printing Electronics Conference
The 3D Printing Electronics Conference will take place on January 22, 2019, at High Tech Campus Eindhoven, The Netherlands.
Various aspects involving (3D) printed electronics, such as:
combining functional elements such as electronics (sensors or switches) into a (3D) printed product hybrid
processes that integrate electronics onto or within 3D printed parts
3D Printed Optics / Photonics
Challenges for manufacturers / engineers / researchers
Future prospects / applications
Who should attend?
Decision makers in the industrial value chain, such as CTO’s and COO’s of OEMs, managers of (high tech) suppliers and subcontractors; Procurement management; Investors; Design & engineering experts; Professionals involved in developing electronic products, such as product designers, engineers, product managers, (consumer) electronics manufacturers, software developers and ‘internet of things’ system integrators; Anyone curious about new technologies and developments in the (3D)printing electronics/optics/photonics industry