Semiconductor Processing Approach to Additive Manufacturing of Printed Electronics – Presented by Jaim Nulman, Nano Dimension

Semiconductor Processing Approach to Additive Manufacturing of Printed Electronics – Presented by Jaim Nulman, Nano Dimension, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

Additive Manufacturing of printed electronics requires the deposition of both dielectric and conductive materials. These materials need to simultaneously comply with both electrical and mechanical requirements. While characterization of mechanical parameters for additive manufacturing is well understood, the electrical performance requires a fresh approach. In this presentation a semiconductor characterization and manufacturing view is presented as means of characterizing both the dielectric and conductive layers of printed electronics. Data shows how printing parameters affects the performance and how process conditions can be used to optimize electrical parameters.

Interview
What drives you?
Innovation

What are the three things you would take with you on a deserted island?
A compass, a notebook, a pen

What emerging technologies/trends do you see as having the greatest potential in the short and long run?
Nano materials

What kind of impact do you expect them to have?
Improved materials for both electronics and medicine

What are the barriers that might stand in the way?
Cost, funding

What do you hope people to learn from your presentation?
The relevance of additive manufacturing for printing electronics and its similarities to semiconductor manufactuirng

About Jaim Nulman
Dr. Nulman is Nano Dimension’s CTO and Executive VP Products. His responsibilities include all aspects of R&D and commercialization for the company’s additive manufacturing equipment and solutions for the printed electronics market: inks, jetting, sintering, engineering, etc. Dr. Nulman was a VP with Applied Materials in Sana Clara CA, where he served in a variety of positions at both the product divisions and corporate levels developing and driving commercialization of semiconductor manufacturing technology and equipment. Dr. Nulman pioneered rapid thermal processing technologies for ultra-thin gate dielectrics in semiconductors. He holds several patents in the area of semiconductor processing and equipment. Dr. Nulman holds a BSc degree in Electrical Engineering from the Technion, MSc and PhD in Electrical Engineering with focus on semiconductor devices and technology from Cornell University, and an Executive MBA from Stanford University.

About Nano Dimension
Nano Dimension’s technologies use advanced nanoparticle inks to enable in-house rapid prototyping of professional, multilayer printed circuit boards (PCBs) and advice manufacturing for electromechanical structures.

By combining advanced inkjet and nano ink technology, the company’s innovative DragonFly 2020 Pro 3D additive manufacturing system prints high resolution multilayer PCB prototypes in a matter of hours, reducing design and test cycles, from months or weeks to days. The DragonFly 2020 sets new standards for accuracy, complexity and speed in the fields of additive manufacturing and electronics prototyping.

About 3D Printing Electronics Conference
The 3D Printing Electronics Conference will take place on January 22, 2019, at High Tech Campus Eindhoven, The Netherlands.

Focus topics:
Various aspects involving (3D) printed electronics, such as:
combining functional elements such as electronics (sensors or switches) into a (3D) printed product hybrid
processes that integrate electronics onto or within 3D printed parts
3D Printed Optics / Photonics
Challenges for manufacturers / engineers / researchers
Future prospects / applications

Who should attend?
Decision makers in the industrial value chain, such as CTO’s and COO’s of OEMs, managers of (high tech) suppliers and subcontractors; Procurement management; Investors; Design & engineering experts; Professionals involved in developing electronic products, such as product designers, engineers, product managers, (consumer) electronics manufacturers, software developers and ‘internet of things’ system integrators; Anyone curious about new technologies and developments in the (3D)printing electronics/optics/photonics industry