Shapetronic platform, a demo case of Vanguard Initiative for 3D printing electronics

presentation by Philippe Guaino, Program leader, CRM Group, at ONLINE 3D Printing Electronics Conference (21 January 2021, 14:00 – 18:00 CET). REGISTER HERE to attend the conference

SHAPETRONICS project is a part of the Nano-enabled Printed Electronics demonstration case under the Vanguard Initiative’s Pilot on New Nano-enabled Products.

SHAPETRONICS aims to address a benchmark of the printing of active surface functions (electrical printed tracks, sensors, optoelectronic devices) on 3D shapes, included metallic objects and severe environments, dedicated to the Internet of Things (IoT), electronics, energy and aerospace/automotive applications. Numerous methods to enhance the active, technological function of the parts themselves will be evaluated and / or newly elaborated. They are classified in two method families: 1) transforming already printed metallic system to final shapes or 2) by direct 3D writing function on the surface of the object.

Dr. Ir Philippe Guaino studied solid-state physics at Aix Marseille University in France. In 2001, he obtained his PhD thesis. From 2001 to 2006, he was a post-doc researcher at ‘National Center for Sensor Research’ in Dublin, Ireland, and other micro- and nano-electronic institutes, in France. Since 2006, he has obtained a permanent position at ArcelorMittal research center, and now at CRM group, in Belgium. As program leader position, he developed printed and structural electronic concept on metal/composites.., severe environment, for 2D foils and 3D shapes.

About CRM Group

At CRM Group, our activities are centred on the production, transformation, coating and use of metallic materials. Since 1948, we offer R&D and technology solutions focusing on the development of innovative processes and products that create value for our industrial partners.

Our group combines skilled and experienced research teams with unparalleled testing facilities covering the whole manufacture chain of metals, from raw materials to advanced steel applications, ranging in size from laboratory scale to pilot and even semi-industrial production lines.

The 3D Printing Electronics Conference is a platform and information interface enabling an exchange of informations on market requirements, research interests and current results, skills and resources as well as facilitating the building of future partnerships. Academics, engineers, designers, and managers are invited to lecture on their state-of-the-art developments and future prospects or display their products and offers as exhibitor. The conference focuses on various aspects involving (3D) printed electronics such as: combining functional elements such as electronics (sensors or switches) into a (3D) printed product hybrid / printed circuit boards, processes that integrate electronics onto or within 3D printed parts, 3D Printed Optics / Photonics, Challenges for manufacturers / engineers / researchers and Future prospects.