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Roughness reduction and functional coating deposition on additive manufactured substrates with ultrasonic spray coating

wim deferme

by Wim Deferme, Hasselt University, Institute for Materials Research (IMO-IMOMEC)

Roughness of as-printed 3D parts is limiting the real breakthrough of Additive Manufacturing. Post processing technologies consist out of subtractive techniques such as grinding or sanding, or out of additive techniques such as coating.

In this presentation Ultrasonic Spray Coating as an additive post processing technologie is described to first of all reduce the roughness of Selective Laser Sintered substrates down to less than 2 micrometer and further, functional formulations consisting out of a polymer and nanoparticles is prepared to not only reduce the roughness but also add functionalities to the surface of the 3D substrate such as scratch resistance or superhydrophobicity.

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Hidden Gems: Examining non-obvious opportunities in 3D Printing of Electronics

bill buel

by Bill Buel, Vice President, Hardware, Origin, USA

3D Printed Electronics will ultimately enable and drive the merging of mechanical and electrical disciplines. Just as desktop 3D printers combined with the many peripheral software components empowers everyday, non-engineers to modify their world to their liking, and realize their innate creativity without formal engineering training, 3D printed electronics will not only open the doors, but will completely remove the roof and enable one of the most impactful forms of creativity and innovation that the world has ever seen.

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Metrology for quality management of printed conductors

Richard Koops

by Richard Koops, VSL Dutch Metrology Institute

First time right production is key in advanced manufacturing processes since usually only relatively small volumes are manufactured. In-line and in-process metrology is required to measure critical to quality process and product parameters. Ultimately, these measurements enable feedback control when the parameters are running out of tolerance.

Within the Hyb-Man project, technologies are being developed for embedded electronics and printed interconnects. Since the functionality of the interconnects determines whether the final product will be accepted or has to be rejected, metrology has been developed to inspect the quality of conducting printed tracks.

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3D Printing of Multi-Functional Structures

eric macdonald

by Eric MacDonald, Youngstown State University

3D printing has generally been relegated to fabricating conceptual models and prototypes; however, increasingly, research is now focusing on fabricating functional end-use products.

As patents for 3D printing expire, new low cost desktop systems are being adopted more widely and this trend is leading to products being fabricated locally. However, currently the technology is limited in the number of materials used in fabrication and consequently is confined to fabricating simple static structures.

For additively manufactured products to be economically meaningful, additional functionalities are required to be incorporated in terms of electronic, electromechanical, electromagnetic, thermodynamic, chemical and optical content.

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Printed Electronics in Education – Presented by Jan Bernards, Fontys University

Jan Berbards

Printed Electronics in Education – Presented by Jan Bernards, Fontys University, at 3D Printing Electronics Conference, on Jan 22, 2019, at High Tech Campus Eindhoven, The Netherlands.

One of the focal points of the research group Applied Natural Sciences (ANS) at the Fontys University of Applied Sciences is Thin Films & Functional Materials. In our laboratory equipment is available for the deposition (inkjet printing, screen printing, plasma printing, spin coating, slot die coating, vacuum deposition) and analysis (SEM with EDS, contact angle measurement, rheology, dynamic light scattering for particle measurement, profilometer) of thin films. Continue reading “Printed Electronics in Education – Presented by Jan Bernards, Fontys University”

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3D Printing Electronics Conference welcomes CECIMO as Content Partner

cecimo

3D Printing Electronics Conference welcomes CECIMO as Content Partner

About Cecimo
Cecimo is the European Association representing the common interests of the Machine Tool Industries globally and at EU level. We bring together 15 National Associations of machine tool builders, which represent approximately 1300 industrial enterprises in Europe (EU + EFTA + Turkey), over 80% of which are SMEs. Continue reading “3D Printing Electronics Conference welcomes CECIMO as Content Partner”

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3D Printing Electronics Conference welcomes Holst Centre as Exhibitor

holst centre

3D Printing Electronics Conference welcomes Holst Centre as Exhibitor

About  Holst Centre
Holst Centre bridges the gap between industry and academia, advancing flexible electronics from lab to fab through robust roadmaps and programs. Working with industrial partners, Holst Centre co-creates innovative solutions for healthcare, automotive, and IOT. Holst Centre is an independent shared-innovation R&D Centre, founded by TNO and IMEC in 2005. Continue reading “3D Printing Electronics Conference welcomes Holst Centre as Exhibitor”

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3D Printing Electronics Conference welcomes LifeSense Group as exhibitor

LifeSense Group

3D Printing Electronics Conference welcomes LifeSense Group as exhibitor

About  LifeSense Group
LifeSense Group is a B2b Netherlands based wearable technology company with customers worldwide. LSG aims to empower people everyday by revolutionizing healthcare with wearable technology. Our international team draws on their breadth of knowledge, expertise, and experiences to continually bring forth new designs and applications for wearable technology. Continue reading “3D Printing Electronics Conference welcomes LifeSense Group as exhibitor”