by Stephen Bennington, Q5D Technology Limited at Online 3D Printing Electronics Conference. REGISTER HERE to attend
Q5D’s technology is the fusion of two technologies: laser sintered printed, which makes it possible to print with copper or silver ink and then use a laser to cure and sinter the ink; and innovative 5-axis additive manufacturing which is able to accurately deposit inks or dielectrics.
This makes it possible to print conductive tracks on large curved surfaces or create complex structures with compact 3D circuitry for surface mounted components.
Continue reading “Q5D Adding Electrical Function”
Printed electronics in practice for a SME – Presented by Hans van de Mortel, Metafas, at the 3D Printing Electronics Conference, on January 28, at High Tech Campus Eindhoven, The Netherlands.
Metafas is a SME what produces printed electronics. There is a gap between production, development and usage. What are the challanges for production and what do designrules mean for production in relation to the costprice ? How do you produce printed electronics is a reasonable cheap production area? Continue reading “Printed electronics in practice for a SME – Presented by Hans van de Mortel, Metafas”
3D Printed Electronics – Agile Manufacture of Mechatronic Systems – Presented by Martin Hedges, Neotech AMT, at 3D Printing Electronics Conference, which will take place on January 22, 2019, at High Tech Campus Eindhoven.
This presentation will review the state-of-the-art related to the production of 3D mechatronic systems via Additive Manufacturing (AM) processes and the scalability to high volume manufacture.
A reconfigurable array of structural and electronics printing, pre- and post processing techniques are combined with SMD technologies to enable digitally driven 3D electronics manufacturing. The resultant flexible process chains can be easily reconfigured to cope with rapid changes in product type whilst retaining the ability to be scaled through to high volume manufacture. Selection of the most appropriate print, pre- and post-processing methods with the subsequent effect on process speed and cost will be discussed. A review of current applications, spanning 3D electronic circuits, antenna, sensor and heater patterns will be conducted along with an update on the progression to First Time Right manufacture of complex devices.
About Dr. Martin Hedges
Graduated BSc (Materials Science) from the University of Manchester (UK) in 1987. Completed a PhD in Materials Science in 1990 from UMIST (UK).
Founded the company Neotech in Nuremberg in 2001 to develop additive manufacturing processes with a focus on Printed Electronics
Since 2009 the company has been pioneering the development of 3D Printed Electronics. Continue reading “3D Printed Electronics – Agile Manufacture of Mechatronic Systems – Presented by Martin Hedges, Neotech AMT”
Printing of metal structures on 3D-printed polymer parts – Presented by Volker Zöllmer, Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.
What drives you?
New technologies, printed electronics, 3D-printing, digital transformation
What are the three things you would take with you on a deserted island?
3D-printer, Smartphone, picture of my family Continue reading “Printing of metal structures on 3D-printed polymer parts – Presented by Volker Zöllmer, Fraunhofer IFAM”
3D Printing Electronics Conference welcomes 3Druck.com as Media Partner
The magazine for 3D printing technologies considers itself as a purely informative medium for the fascinating topic of 3D printing. You can read daily updated news about this interesting and increasingly popular field. Continue reading “3D Printing Electronics Conference welcomes 3Druck.com as Media Partner”
Creating the Uber of Consumer Electronic Product Manufacturing – Presented by Senake Atureliya, Buzz Technology Limited at the 3D Printing Electronics Conference, which takes place on Jan 23, 2018 at High Tech Campus Eindhoven in The Netherlands.
Crowd funding has given us the Occulus Rift and VR, Pebble and the smart watch. Peer-to-peer marketplaces such as AirBNB and Uber have enabled people all over the world to unlock the value of their underused time and assets. In this talk, Buzz Technology will describe a solution with similar economic potential. Using robotic, 3D printing and a peer-to-peer development/production platform, they aim to unlock the creative, productive and commercial value of the crowd by enabling the overnight small batch manufacture of products incorporating electronics, actuators and batteries. The company are interested in speaking with investors and joint venture partners. Continue reading “Creating the Uber of Consumer Electronic Product Manufacturing – Presented by Senake Atureliya, Buzz Technology Limited”
FOR the past few months, a factory in China has been spitting out a new kind of smartphone. Inside each is an antenna that was 3D-printed directly onto the plastic housing.
It doesn’t sound like much, but this ability to print electronic components at the scale and speed required by the smartphone industry is new. It has the potential to usher in a world where sensors and electronics are embedded in everything around us. Continue reading “World of instant electronic everything begins: Circuits can now be 3D-printed directly into electronic devices”
The talk will outline our recent activities in the area of 3D printing of electronic devices and will include our recent work on the 3D printing of dense piezoceramics for ultrasound applications and our efforts in depositing circuits on complex 3D surfaces.
About Simon Leigh Continue reading ““3D Printing of Electronic Devices – From 3D Ceramics to Printing on Complex Surfaces” – Presented by Dr. Simon Leigh, University of Warwick”
Today, with the emergence of printing electronics, it is now possible to print high quality, complex, and reliable circuitry directly onto the special grades of papers that Arjowiggins developed, named Powercoat. This paper has an exceptionally smooth surface, a high temperature resistance favorable for sintering of conductive inks, and is completely biodegradable. Continue reading ““Printing Electronics: The future of paper” – Presented by Gael Depres, Arjowiggins”
By integrating electronics into loadbearing or protective structures, conventionally dumb plastic parts can be made smart. Currently different techniques like thermoforming and inmold are being explored. Utilizing the freedom of shape and flexibility of 3D printing techniques and combining the technologies from flexible electronics a new manufacturing paradigm is being developed. TNO is developing such manufacturing technologies towards mass customization of structural electronics. This will enable industries to accelerate innovations in this filed towards faster time to market. This presentation will talk about the current efforts from TNO towards this realization and the future vision. Continue reading ““Structural Electronics; the new manufacturing paradigm”, Presented by Rajesh Mandamparambil, TNO”