The Electro-mechanical analysis of conductive tracks in Lightweight Embedded Electronics

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The increasing demand for flexible, stretchable and embedded electronic technologies has resulted in the deployment of Additive Manufacturing (AM) techniques for the production of electronic components and interconnecting conducting tracks via the accurate and selective deposition of conductive inks. The electromechanical performance of the conductive track material is captured by the response of the effective resistivity under increasing mechanical strains and of particular importance for the functionality of the printed products.

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