3D Printed Electronics – be part of the ecosystem

by Corne Rentrop, Holst Centre

The printed electronics community is fastly growing. The latest actions involve high TRL work, aiming towards upscaling and industrialisation. This requires input from the complete value chain. Machine builders, materials and technology suppliers, are working with end-users to meet market specific requirements and allow industrialisation. The talk discusses how this is organised at the Holst Centre, complemented with some end-users examples.

Continue reading “3D Printed Electronics – be part of the ecosystem”

Printed electronics – overview of the fundamentals, applications and equipment – Presented by Corne Rentrop, TNO – Holst Centre

Corne Rentrop

Printed electronics – overview of the fundamentals, applications and equipment – Presented by Corne Rentrop, TNO – Holst Centre, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

Holst Centre has been active in printed electronics for 12 years. In these 12 years the development of printed electronics was matured from basic fundamental research (TRL 3-4) towards application research (TRL6-7). In the latest developments the (R2R) printing and assembly equipment was matured as well as development of new interconnection technologies. The talk will explain these technologies in more detail and wll show the latest (large scale) applications. Continue reading “Printed electronics – overview of the fundamentals, applications and equipment – Presented by Corne Rentrop, TNO – Holst Centre”

Printed Electronics: towards Industrial application – Presented by Corne Rentrop, Holst Centre/TNO

Corne Rentrop

Printed Electronics: towards Industrial application – Presented by Corne Rentrop, Holst Centre/TNO, at the 3D Printing Electronics Conference, which takes place on Jan 23, 2018 at High Tech Campus Eindhoven in The Netherlands.

In the last 10 years Holst Centre pioneered the printed electronics community. Electric circuit boards, OLEDs and transistors are printed on foil, ready to become flexible and producible on large scale using state of the art printing processes. New steps in the development of printed electronics are 3D forming of electrics using In-Mold or Thermoforming techniques (Structural electronics). Applications can be found in automotive and domestic markets. To industrialize printed electronics new projects are started that focus on reliability and manufacturability of the printed electronics techniques.

The talk will focus on this industrialization by explaining necessary manufacturing steps in printed electronics such as printing, pick and place and post-processing techniques. To focus on 3D electronics the talk will also include the recent developments in structural electronics. Continue reading “Printed Electronics: towards Industrial application – Presented by Corne Rentrop, Holst Centre/TNO”