Design Toolchain and Slicing Process for the Integration of Electronics into FDM Printed Objects – Presented by Florens Wasserfall, University of Hamburg

Florens Wasserfall

Design Toolchain and Slicing Process for the Integration of Electronics into FDM Printed Objects – Presented by Florens Wasserfall, University of Hamburg at the 3D Printing Electronics Conference, which takes place on Jan 23, 2018 at High Tech Campus Eindhoven in The Netherlands.

The integration of wires and electronic components into additive fabrication processes has recently been demonstrated by a number of research groups. However, the overall design flow, from initial schematics capture to component placement, process compatible wire routing, and generation of slicing toolpaths remains an important, yet unsolved problem.

In this talk, we present a full toolchain to design and print 3D-electronics with a modified FDM printer. The focus lies on a modified slicer which imports both the 3D CAD model and a common EAGLE PCB schematic. The user works in a 3D representation of the final extruder toolpath, augmented by the routing information. Continue reading “Design Toolchain and Slicing Process for the Integration of Electronics into FDM Printed Objects – Presented by Florens Wasserfall, University of Hamburg”