Packaging of electronic devices using 3D printing technology – Presented by Gabrielle Aspar, LETI, CEA Grenoble

Gabrielle Aspar

Packaging of electronic devices using 3D printing technology – Presented by Gabrielle Aspar, LETI, CEA Grenoble at the 3D Printing Electronics Conference, which takes place on Jan 23, 2018 at High Tech Campus Eindhoven in The Netherlands.

In this paper we present a new approach for building specific packaging that is scalable, versatile and could be potentially cost competitive. Using polymer additive manufacturing, more commonly known as 3D printing, we set out to build customized structures and packages perfectly adapted to component dimensions and specifications. Two different 3D printing technologies, respectively called stereolithography and Fused Deposition Molding, were studied. The work described in this paper opens plenty of new approaches: device design with a customizable backend packaging process, packaging adapted to each different component, even on the same device, fast device prototyping with accurate characteristics, among others. Continue reading “Packaging of electronic devices using 3D printing technology – Presented by Gabrielle Aspar, LETI, CEA Grenoble”