Hybrid electronics integration by inkjet technology – Presented by Marcel Grooten, DoMicro BV

Marcel Grooten

Hybrid electronics integration by inkjet technology – Presented by Marcel Grooten, DoMicro BV, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

DoMicro BV has progressed in advanced packaging and integration of conventional electronics in flexible foils structures. Printing multi-layers, passive components and interconnection of thinned silicon dies is enabled by revolutionary developments in nano-printing and specific inkjet technology. Several examples will be discussed including a functional flexible microsensor application. Continue reading “Hybrid electronics integration by inkjet technology – Presented by Marcel Grooten, DoMicro BV”