Dimensional Control & Process Assembly for 3D Electronics at Industrial Scale – Presented by Yu Liu, Jiangnan University

Yu Liu

Dimensional Control and Process Assembly for 3D Electronics at Industrial Scale – Presented by Yu Liu, Institute of Precision Intelligent System Engineering (iPISE), School of Mechanical Engineering, Jiangnan University at the 3D Printing Electronics Conference, which takes place on Jan 23, 2018 at High Tech Campus Eindhoven in The Netherlands.

In this speech, development of automated printing platform, which owns high – level capability for direct fabrication of 3D electronics, will be given. Emphasizes will be on process control for precise dimensioning of ink based filaments and function deposition. We are going to deliver something which local industrial partners are thinking about. For devices, I will share with direct fabrication of highly stretchable strain sensor and smart cushion with sensing capabilities. Final remarks will be given on how far to integrate intelligence from different printing engineering for more complex implementation. Continue reading “Dimensional Control & Process Assembly for 3D Electronics at Industrial Scale – Presented by Yu Liu, Jiangnan University”