Semiconductor Processing Approach to Additive Manufacturing of Printed Electronics – Presented by Jaim Nulman, Nano Dimension

Jaim Nulman

Semiconductor Processing Approach to Additive Manufacturing of Printed Electronics – Presented by Jaim Nulman, Nano Dimension, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.

Additive Manufacturing of printed electronics requires the deposition of both dielectric and conductive materials. These materials need to simultaneously comply with both electrical and mechanical requirements. While characterization of mechanical parameters for additive manufacturing is well understood, the electrical performance requires a fresh approach. In this presentation a semiconductor characterization and manufacturing view is presented as means of characterizing both the dielectric and conductive layers of printed electronics. Data shows how printing parameters affects the performance and how process conditions can be used to optimize electrical parameters. Continue reading “Semiconductor Processing Approach to Additive Manufacturing of Printed Electronics – Presented by Jaim Nulman, Nano Dimension”