Francis Van Vehmendahl, Mitsubishi Engineering Plastics will speak at 3D Printing Electronics Conference 2019

Francis Van Vehmendahl

Francis Van Vehmendahl, Mitsubishi Engineering Plastics will speak at 3D Printing Electronics Conference 2019

In the last decade the LPKF-LDS technology matured into an accepted manufacturing method. This is especially the case in Asia were LDS materials are widely applied in wireless communication devices, such as mobile phones, notebooks and smart wearables. The most common used LDS material for these antenna applications is polycarbonate (PC) due to its well-balanced properties such as impact strength, processability, surface appearance and radio frequency (RF) performance. Continue reading “Francis Van Vehmendahl, Mitsubishi Engineering Plastics will speak at 3D Printing Electronics Conference 2019”