by Corne Rentrop, Holst Centre
The printed electronics community is fastly growing. The latest actions involve high TRL work, aiming towards upscaling and industrialisation. This requires input from the complete value chain. Machine builders, materials and technology suppliers, are working with end-users to meet market specific requirements and allow industrialisation. The talk discusses how this is organised at the Holst Centre, complemented with some end-users examples.
Continue reading “3D Printed Electronics – be part of the ecosystem”
Printed electronics in practice for a SME – Presented by Hans van de Mortel, Metafas, at the 3D Printing Electronics Conference, on January 28, at High Tech Campus Eindhoven, The Netherlands.
Metafas is a SME what produces printed electronics. There is a gap between production, development and usage. What are the challanges for production and what do designrules mean for production in relation to the costprice ? How do you produce printed electronics is a reasonable cheap production area? Continue reading “Printed electronics in practice for a SME – Presented by Hans van de Mortel, Metafas”
Printed electronics – overview of the fundamentals, applications and equipment – Presented by Corne Rentrop, TNO – Holst Centre, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.
Holst Centre has been active in printed electronics for 12 years. In these 12 years the development of printed electronics was matured from basic fundamental research (TRL 3-4) towards application research (TRL6-7). In the latest developments the (R2R) printing and assembly equipment was matured as well as development of new interconnection technologies. The talk will explain these technologies in more detail and wll show the latest (large scale) applications. Continue reading “Printed electronics – overview of the fundamentals, applications and equipment – Presented by Corne Rentrop, TNO – Holst Centre”
Printed Electronics: towards Industrial application – Presented by Corne Rentrop, Holst Centre/TNO, at the 3D Printing Electronics Conference, which takes place on Jan 23, 2018 at High Tech Campus Eindhoven in The Netherlands.
In the last 10 years Holst Centre pioneered the printed electronics community. Electric circuit boards, OLEDs and transistors are printed on foil, ready to become flexible and producible on large scale using state of the art printing processes. New steps in the development of printed electronics are 3D forming of electrics using In-Mold or Thermoforming techniques (Structural electronics). Applications can be found in automotive and domestic markets. To industrialize printed electronics new projects are started that focus on reliability and manufacturability of the printed electronics techniques.
The talk will focus on this industrialization by explaining necessary manufacturing steps in printed electronics such as printing, pick and place and post-processing techniques. To focus on 3D electronics the talk will also include the recent developments in structural electronics. Continue reading “Printed Electronics: towards Industrial application – Presented by Corne Rentrop, Holst Centre/TNO”
3D Printing Electronics Conference welcomes Haptic.ro as Media Partner
HAPTIC R&D CONSULTING is a consulting of global technology and engineering company providing innovative solutions for customers in industrial, commercial, and residential markets. Our goal is your target in a future visionary way to create a synergy business bridge between SME’s companies and R&D laboratories to merge together in revolutionary and innovation projects.
HAPTIC R&D CONSULTING stays focussed both on private and public organisations, NGOs, universities, educational institutes and agencies offering various services related to European funded programmes such as Horizon 2020 helping them to access EU funds.
For more info please visit our website www.haptic.ro or contact us: firstname.lastname@example.org.
About 3D Printing Electronics Conference
Date & Location: January 23, 2018, High Tech Campus, The Netherlands Continue reading “3D Printing Electronics Conference welcomes Haptic.ro as Media Partner”
FOR the past few months, a factory in China has been spitting out a new kind of smartphone. Inside each is an antenna that was 3D-printed directly onto the plastic housing.
It doesn’t sound like much, but this ability to print electronic components at the scale and speed required by the smartphone industry is new. It has the potential to usher in a world where sensors and electronics are embedded in everything around us. Continue reading “World of instant electronic everything begins: Circuits can now be 3D-printed directly into electronic devices”
Nano Dimension Ltd. revealed the world’s first desktop-sized 3D printer designed specifically for the production of professional multilayer printed circuit boards (PCBs). The DragonFly 2020 3D Printer, being demonstrated in the US for the first time at the Printed Electronics USA 2015 conference (Booth F09), will allow users to build functional, multilayer circuit board prototypes in-house –in a matter of hours. Continue reading “Nano Dimension Releases World’s First 3D Printer for Professional Multilayer PCBs”