Printed Electronics in Education – Presented by Jan Bernards, Fontys University, at 3D Printing Electronics Conference, on Jan 22, 2019, at High Tech Campus Eindhoven, The Netherlands.
One of the focal points of the research group Applied Natural Sciences (ANS) at the Fontys University of Applied Sciences is Thin Films & Functional Materials. In our laboratory equipment is available for the deposition (inkjet printing, screen printing, plasma printing, spin coating, slot die coating, vacuum deposition) and analysis (SEM with EDS, contact angle measurement, rheology, dynamic light scattering for particle measurement, profilometer) of thin films. Continue reading “Printed Electronics in Education – Presented by Jan Bernards, Fontys University”
Printed electronics – overview of the fundamentals, applications and equipment – Presented by Corne Rentrop, TNO – Holst Centre, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.
Holst Centre has been active in printed electronics for 12 years. In these 12 years the development of printed electronics was matured from basic fundamental research (TRL 3-4) towards application research (TRL6-7). In the latest developments the (R2R) printing and assembly equipment was matured as well as development of new interconnection technologies. The talk will explain these technologies in more detail and wll show the latest (large scale) applications. Continue reading “Printed electronics – overview of the fundamentals, applications and equipment – Presented by Corne Rentrop, TNO – Holst Centre”
Francis Van Vehmendahl, Mitsubishi Engineering Plastics will speak at 3D Printing Electronics Conference 2019
In the last decade the LPKF-LDS technology matured into an accepted manufacturing method. This is especially the case in Asia were LDS materials are widely applied in wireless communication devices, such as mobile phones, notebooks and smart wearables. The most common used LDS material for these antenna applications is polycarbonate (PC) due to its well-balanced properties such as impact strength, processability, surface appearance and radio frequency (RF) performance. Continue reading “Francis Van Vehmendahl, Mitsubishi Engineering Plastics will speak at 3D Printing Electronics Conference 2019”
Integrated Electronic Functionalities in 3D Printed Products – Presented by Fabien Bruning, TNO, at the 3D Printing Electronics Conference, on January 22, at High Tech Campus Eindhoven, The Netherlands.
Combining the flexibility of 3D printing techniques with technologies from flexible electronics creates a new manufacturing paradigm for products with integrated electronic functionalities. Free form is no longer only applicable to the structural part, but also to the embedded electronics. In this presentation we will showcase our development based on SLA (Stereo Lithography). With SLA high quality 3D products can be manufactured, yet the integration with other manufacturing technologies is more challenging than some other AM technologies. This presentation will focus on the challenges and our achievements in integrating electronic structures during the 3D printing processes.
Continue reading “Integrated Electronic Functionalities in 3D Printed Products – Presented by Fabien Bruning, TNO”
We need to understand at microscopic level what is happening during the printing process – Interview with 3D Printing Electronics Conference speaker Wijnand Germs
As Project Manager with the Dutch research institute TNO Wijnand Germs specializes in the integration of electronics in 3D printing, also called ‘structural electronics’. He and his colleagues are developing a 3D printer that will eventually be able to manufacture high-quality products with the electronics already in place. That’s a major step forward from the current 3D printers, which are mainly used for prototyping. Continue reading “We need to understand at microscopic level what is happening during the printing process – Interview with 3D Printing Electronics Conference speaker Wijnand Germs”
Meyer Burger will present the status of inkjet printing of functional materials for printed electronics. Inkjet technology opens numerous applications and is able to print a wide range of materials. The presentation will address both 2D applications and will touch on research being done to achieve three dimensional, inkjet printed objects with multi-functional layers. Continue reading ““Inkjet printing for 2D and 3D printed electronics” – Presented by Joost Valeton, Meyer Burger”
The talk will outline our recent activities in the area of 3D printing of electronic devices and will include our recent work on the 3D printing of dense piezoceramics for ultrasound applications and our efforts in depositing circuits on complex 3D surfaces.
About Simon Leigh Continue reading ““3D Printing of Electronic Devices – From 3D Ceramics to Printing on Complex Surfaces” – Presented by Dr. Simon Leigh, University of Warwick”
Today, with the emergence of printing electronics, it is now possible to print high quality, complex, and reliable circuitry directly onto the special grades of papers that Arjowiggins developed, named Powercoat. This paper has an exceptionally smooth surface, a high temperature resistance favorable for sintering of conductive inks, and is completely biodegradable. Continue reading ““Printing Electronics: The future of paper” – Presented by Gael Depres, Arjowiggins”
By integrating electronics into loadbearing or protective structures, conventionally dumb plastic parts can be made smart. Currently different techniques like thermoforming and inmold are being explored. Utilizing the freedom of shape and flexibility of 3D printing techniques and combining the technologies from flexible electronics a new manufacturing paradigm is being developed. TNO is developing such manufacturing technologies towards mass customization of structural electronics. This will enable industries to accelerate innovations in this filed towards faster time to market. This presentation will talk about the current efforts from TNO towards this realization and the future vision. Continue reading ““Structural Electronics; the new manufacturing paradigm”, Presented by Rajesh Mandamparambil, TNO”
DoMicro BV is a startup company providing a state of the art integrated manufacturing solution and system for hybrid electronics. This fully multifunctional and automated tool set enables flexible manufacturing and versatile processing of any kind of electronic structure. Applying all kinds of technologies and integrating them in one system creates new possibilities in assembly and manufacturing like reverting process sequences and other steps in classical manufacturing methods and technology. This revolutionizes the traditional value chain of electronic assemblies. Integration and optimizing processes, recipes and then moving seamlessly from R&D into volume manufacturing is the name of the game for DoMicro. This new and smart manufacturing principle will be presented and discussed. Continue reading ““Production & Technology for Hybrid Electronics”, Presented by Marcel Grooten, DoMicro BV”