Printed Electronics: towards Industrial application – Presented by Corne Rentrop, Holst Centre/TNO, at the 3D Printing Electronics Conference, which takes place on Jan 23, 2018 at High Tech Campus Eindhoven in The Netherlands.
In the last 10 years Holst Centre pioneered the printed electronics community. Electric circuit boards, OLEDs and transistors are printed on foil, ready to become flexible and producible on large scale using state of the art printing processes. New steps in the development of printed electronics are 3D forming of electrics using In-Mold or Thermoforming techniques (Structural electronics). Applications can be found in automotive and domestic markets. To industrialize printed electronics new projects are started that focus on reliability and manufacturability of the printed electronics techniques.
The talk will focus on this industrialization by explaining necessary manufacturing steps in printed electronics such as printing, pick and place and post-processing techniques. To focus on 3D electronics the talk will also include the recent developments in structural electronics.
About Corne Rentrop
Corne Rentrop (MsC.), is a project manager at TNO with over 18 years’ experience in research and development. Corne works at the Holst Centre in the hybrid printed electronics group as senior research scientist and project-manager for “pilot-line projects” and “stretchable electronics”. In his function Corne is listed on several patents and publications. He has been active in development and execution of several (MEUR) projects both bilateral (with industry) and through Public funding. He is coordinating the project ROPAS (roll to roll paper sensors), and InSCOPE (Open access pilot line, Horizon 2020) and the regional funded OPZuid project.
About Holst Centre/TNO
Holst Centre/TNO (www.holstcentre.com), set up in 2005 by the mother organisations (TNO and IMEC), is an independent shared-innovation R&D Centre for Flexible Electronics and Sensor Technologies in the Netherlands with around 200 full time researchers, as well as industrial residents from its partner companies. A key feature is its partnership model with industry and academia comprising more than 40 international companies. Holst Centre/TNO has major activities in the areas of TOLAE, (hybrid) printed electronics, flexible OLEDs, photovoltaics and transistor technology. Its aim is to develop technologies and processes that ultimately will be transferred to industry and partner companies. Holst Centre has demonstrated sheet-to-sheet and roll-to-roll solution processed for numerous hybrid and printed electronics products, varying from printed temperature and humidity sensing devices, paper electronics, health-patches, smart garments, and (thermoformed) stretchable products.
About 3D Printing Electronics Conference
The 3D Printing Electronics Conference will take place on January 23, 2018, at High Tech Campus Eindhoven, The Netherlands.
Various aspects involving (3D) printed electronics, such as:
combining functional elements such as electronics (sensors or switches) into a (3D) printed product hybrid
processes that integrate electronics onto or within 3D printed parts
3D Printed Optics / Photonics
Challenges for manufacturers / engineers / researchers
Future prospects / applications
Who should attend?
Decision makers in the industrial value chain, such as CTO’s and COO’s of OEMs, managers of (high tech) suppliers and subcontractors; Procurement management; Investors; Design & engineering experts; Professionals involved in developing electronic products, such as product designers, engineers, product managers, (consumer) electronics manufacturers, software developers and ‘internet of things’ system integrators; Anyone curious about new technologies and developments in the (3D)printing electronics/optics/photonics industry